Raenin provides state-of-the-art single crystal and polycrystalline silicon material products including ingots, wafers, targets, and components. The maximum diameter of silicon targets and wafers can reach 18 inches. We can produce silicon materials with a purity of 5N-6N and a resistivity typically greater than 0.005ohm-cm to meet the needs of customers.
Raenin supplies a series of germanium products including ingots, granules, targets and wafers. Germanium purity is typically in the range of 5N-6N. We can machine the germanium material into shapes and dimensions per customer specifications.
Raenin provides sapphire products including ingots, wafers and components. The diameter of sapphire ingorts and wafers can reach 6 inches to meet the needs of customers.
Raenin is one of the few manufacturers in the world having the technologies capable of producing both PVD (physical vapor deposition) and CVD/ALD (Chemical Vapor Deposition /Atomic Layer Deposition) electronic materials products, We can provide W, Ta, Ru and other organic-metal CVD/ALD precursor materials.
Raenin produces evaporation materials of Cu, Al, Ni, Cr, Ti, Co, Zn, Ge, Re and Ru in form of irregular particles or small cylindrical shapes per customer specifications. We can also produce customized evaporation materials of oxides (including rare earth oxides), nitrides, and silicides upon request.
Rare and precious metals including Ag, Au,Pt, Ru, Hf, Ir, Pd, and V are indispensable in modern industry. Raenin provides high purity (≥3N5) precious metals for semiconductor chips, electronics, chemicals, and machinery industries.
Utilizing local abundant rare earth metal mineral resources, Raenin has continuously improved the processes to provide customers with high quality La、Sc、Er、Yb、Y、Pr、Nd、Sm、Eu、Gd、Tb、Lu、Ce rare earth metals, oxides, and magnetic compound materials. 3N-5N is the typical purity for these rare earth materials used in the semiconductor chip manufacturing and electronic information industries
Raenin locates in Ganzhou, nonferrous metal-rich area in China, known as “World Tungsten Center” and “Rare Earth Metal Kingdom”. Utilizing abundant local non-ferrous metal resources, we produce Ta, Ti, Al, Cu, Cr, Co, W, Mo, Ni, V, NiV, and NiPt materials in form of plate, bar, powder and part used for semiconductor, battery, medicine, and aerospace industries. We have expertise in purification, metallurgy, synthesis, and materials processing using integrated manufacturing technologies and guarantee strict material composition and grain size control to produce ingots, plates and machining parts per customer specifications.
Sputtering target is one of the key electronic material products supporting the fabrication of semiconductor chips. With continuous development and improvement, Raenin can provide customers with high purity sputtering targets of various sizes and configurations including Ta, Ti, Cu, Al, Co, Si, W, Ni, and V pure metals, and AlSi, AlSiCu, CuMn, CuAl, NiPt, NiV, TiAl, WSi, and WTi alloys sputtering targets. Typical material purities are in the range of 99.99% to 99.9999% (4N to 6N). These products are widely used in the 60nm、45-28nm、22-10nm and less than 10nm process nodes of modern integrated circuit semiconductor chips.
Raenin provides thin film transistor (TFT) flat panel display (FPD) industry and market with Al, Cu, Mo, Ti, Ag, Cr, ITO, AZO targets of different OEM designs, generations, dimensions, and configurations upon request
We are committed to developing high quality sputtering targets of different materials including Al, Cu, Cr, Ti, Mo, WTi, NiV, NiCr, CuNi, ZnMgO, ITO and AZO to supply solar energy photovoltaic power industry for energy conservation and environment protection. The target material purity is in the range of 3N-6N.
