Micro-electrical mechanical systems (MEMS) continue to grow in importance across a wide variety of industries. Their delicate microscopic components need power, I/O interconnects and reliable protection, so SCHOTT offers a range of highly robust, precise and miniature packaging components and materials.

MEMS Packaging
As MEMS components get smaller and more powerful, the need for equally minute packaging solutions grows. SCHOTT provides a variety of glass materials and hermetic packaging components and technologies, such as high-precision TO PLUS® and glass micro bonding offered by SCHOTT Primoceler. These reliable packaging options retain long-term gas tightness to protect the MEMS from heat damage and mechanical exposure.

Scientist holding a circular mirror looking at their reflection
MEMS Mirrors
Electromagnetically driven mirrors with MEMS technology are widely used in the communications and intelligent safety industries. These mirrors are highly delicate and must be protected from moisture and dust particles, yet require a high performance optical interface. Ultra-thin glasses such as MEMpax®, D263® and BOROFLOAT® are ideal for mirror substrates, while our hermetic transistor outline and microelectronic packages enable MEMS mirrors to perform with optimum capability in challenging environments.

Microscopic pressure sensor for MEMS package
Pressure Sensors
SCHOTT has an unrivalled portfolio of products to protect MEMS sensors from the environment, as well as a range of functional components for the sensors themselves. MEMpax® and BOROFLOAT® are flat, highly homogenous borosilicate glasses that are ideally suited to anodic bonding, while FLEXINITY® is an innovative portfolio of structured wafer and glass substrates. In addition, HermeS® wafers offer rugged and durable chip size packaging for industrial sensors.

SCHOTT has been a pioneer in wafer glass technology for many years, and this experience enables us to offer innovative, lightweight and miniaturized components for MEMS packaging. Our technology is also key to the production of high quality optical components for camera imaging and WLP for optical sensors.
Large glass wafer in production
Through-Glass Via Wafers
SCHOTT HermeS® hermetic through-glass via (TGV) wafers offer a wafer substrate with significant reliability and miniaturization advantages over through silicon vias or ceramic packaging. With SCHOTT’s Primoceler™ glass micro bonding, it provides transparent all-glass wafer level chip-scale packaging (WL-CSP) with sealed-in electrical connections in and out of MEMS devices. As well as robust and miniature designs, our glass packaging features high thermal conductivity and excellent RF performance.

Scientist holding a glass wafer with gloved hands
Substrate Glass for Wafer Production
Wafer production requires a very flat glass with a high, mirror-like degree of homogeneity allied to outstanding optical qualities. BOROFLOAT® 33 answers that challenge thanks to the microfloat process used in its manufacture. MEMpax® is also a borosilicate glass, but its down-draw production process enables the manufacture of UTG substrates. Both are a versatile choice even in heavy-duty environments due to their high mechanical, thermal and chemical resistance.

Glass wafer being inspected in the laboratory
Lighting for Wafer Inspection
SCHOTT supports customers requiring wafer inspection to ensure systems are functioning at their optimum level. Highly advanced light guides ensure precise wafer positioning and alignment of optical paths.

Hands bending SCHOTT FLEXINITY® structured wafer glass
Structured Wafer
SCHOTT has set a new standard for structured wafer glass substrates with FLEXINITY®, a highly versatile product portfolio that offers customers complete freedom of design. FLEXINITY® also offers impressive precision, enabling new applications and further miniaturization in IC packaging, sensors, batteries, biochips and diagnostic technology.

Scientist holding a large glass wafer with gloved hands
Unstructured Wafer
Among the huge range of SCHOTT glass products are unstructured wafer glasses such as BOROFLOAT® 33, AF32® and D263®, which are ideal for transformation applications. B270® D ultra-white glass, for instance, comes in a wide range of thicknesses and offers a fire-polished surface, making it well-suited to biotech applications. 

Thumb pressing on blue glass touchscreen
Ultra Thin Wafer
One advantage of SCHOTT’s ultra-thin wafer glasses is that many boast eco-friendly properties. But while they are free of refining agents such as arsenic and antimony, they don’t lack versatility. SCHOTT AS 87 eco is the world’s first high-strength ultra-thin glass available in mass volume, and is ideal for use in screen protectors or fingerprint sensor covers. D 263® T eco Thin Glass is easy to cut, process and shape, making it highly adaptable, while AF32® eco thin glass has high temperature resistance for demanding applications.

Gloved hand holding a glass wafer
Wafer Passivation
To protect discrete semiconductor surfaces from environmental stressors such as chemicals or mechanical impact, SCHOTT offers high-purity passivation glasses that are applied to passivate the p-n-junction. High insulation properties are achieved through minimal alkali and iron content. The wide choice of top-grade glass compositions includes lead-free solutions for all common passivation applications.

Blue circuit board with series of microchips
Wafer-Level Chip Scale Packaging
Wafer-level chip-scale packaging (WLCSP) has evolved to provide an extremely high-volume, low-cost solution for the packaging of integrated circuits. And while it’s now a well-established technology, fragility of chip-scale devices remains a concern. SCHOTT offers a variety of specialty materials and technologies to enable improvements in the strength and reliability of WLCSP.