CoS Die Bonder
Project One
Die- & Flip Chip Bonder
ASM AMICRA Microtechnologies is a worldwide leading supplier of ultra high precision Die Attach Equipment specializing in submicron placement accuracy (±0.3µm@3s). Our equipment offering supports:
Die Attach and Flip Chip Bonding
High Speed Wafer Inking and Inspection
High Speed Dispense System and Custom Solutions
Our market focus includes: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP, Automotive Sensors/LiDAR.
