C&D Semiconductor is a USA based capital equipment supplier. As a customer focused company, systems are built optimized to customer requirements. This can include optimized configurations, foot print and software. Additionally, C&D has the expertise and capability to develop customer specific features or tool sets.
Having a broad international customer base, C&D systems are deployed with a wide range of customers: semiconductor device manufacturers; compound semiconductor device manufacturers; MEMS and LED suppliers; biosensor manufacturers; high volume manufactures; low volume high dollar value manufactures. Wafer sizes range from 2” to 300 mm wafers and wafers on tape frames and HOOPs.
Common applications for C&D products are: photoresist coat & develop; planarized spin coating; metal lift-off; laminate photoresist develop; alloy or low temperature anneal; dice protect layers.
The main product platform is the C&D P9000 which is a cluster type system built around a central wafer handling robot. All of C&D’s process modules can be incorporated into the P9000 due to the flexible design. This enables customers to design systems for optimized performance at the lowest cost-of-ownership. Additionally, C&D continues to support linear track customers with its P8000 product and spare parts for the large installed base of linear tracks.
Photoresist Coating
Photoresist Coating
Photoresist, spin on dielectric, and dopants
Photoresist Developer
Photoresist Developer
Aqueous, Solvent, and Aspirated solvent developers
Wafer on Tape Frame
Wafer on Tape Frame
Protect coat & clean for saw/dicing
Srubber
Wafer Cleaning / Scrubber
High pressure and mechanical cleaning
Lift-off Systems
Metal Lift-Off
Heated solvent with metal recovery
wafer inspector
Wafer Inspection
Bright Light Macro Inspection
Wafer Loader
Microscope Loader
Universal loader for most microscopes
wafer sorter
Wafer Sorter
Traditional sorting with OCR
Wafor Alloy Anneal
Wafer Alloy - Anneal
Economical Rapid Single wafer alloy
Optical Edge Bead Exposure
Optical Edge Bead Exposure
Programmable, multiple wave length capable
Planarized Coating
Closed Lid Co-Rotation Coater
Closed co-rotating lid
Utrasonic Coating System
Spray Coating
Ultrasonic technology
Piezoelectric Wafer Processing
Minimize ESD during processing
Application
Photoresist Coat
Spin on Glass (SOG), Dopants
Polyimide, BCB
Positive and negative resist
PMGI
PMMA
Photoresist Develop
Positive or Negative Develop
Solvent spray, stream or aspirated
Photoresist and Spin-On Dielectric Planarization
Planarization of Thick Photoresist and Spin-On Dielectric
Polyimide, BCB
Closed Bowl Spinning, for reduced chemical consumption
Spray Coating
Ultrasonic spray
Compound Wafer Alloy
Low-Temperature Annealing and Sintering
Ohmic Alloy
Resistor stabilization
Hillock formation reduction
Dry Thin Film Develop
Copper Bump/Pillar
Resist thicknesses exceeding 100um
Metal Lift-Off
Thin and thick metal lift off
Photoresist strip
Processing Wafers on Tape Frame and Hoops
Dice Protection Coat
Post Dice Clean & Strip
Piezo Electric Wafer Processing
Controlled ESD processing
Bio Science
Medical sensors
Cancer detection
Peptide Synthesizing
High Volume Manufacturing
Dual Centralized Robot capability
Wafer Flip
