IC Laser Marking System
Products application ：
1. Automatic loading/unloading (Slot/Stack magzine), high efficency.
2. Automatic marking position adjusting by using CCD vision positioning.
3. SECS-GEM supported.
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FPC、PCB Laser Cutting System
Products application ：
Suitable for high-precision Laser processing such as FPC/PCB/Finger Module Cutting & Perforating. Manual/Automatic loading & unloading handler optional. Come with customized dust proof & vacuum dust exhausting system.
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SIP Laser Cutting System
Products application ：
Suitable for SIP (system in package),compatible for 2D Barcode Laser marking, Laser grooving, Laser cutting. Manual/Automatic loading & unloading handler optional. Come with customized dust proof & vacuum dust exhausting system.
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Plasma Cleaning System
Products application ：
1.It is suitable for cleaning products of L/F, Substrate and BGA before W/B and before molding in semiconductor packaging process.
2.It adopts automatic program control interface and touch screen man-machine interface,and is easy to operate.
3.With unique cavity design, it has good cleaning uniformity and high cleaning quality.
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Wafer Laser Grooving System
Products application ：
It is available for wafer Laser grooving
