The need for a more connected, more autonomous, and smarter world drives innovation in semiconductor and microelectronic devices, which require consistent improvements in performance, energy efficiency, security, cost, and reliability. Focus must also be given to improving time-to-market and time-to-yield. However, shrinking geometries, new materials, and novel 3D architectures make these continual improvements increasingly more challenging. As a result, current 2D metrology and inspection workflows are no longer adequate for device manufacturing. Instead, high-productivity 3D analysis workflows are now essential to the fabrication process.
Overall, these 3D analysis tools and workflows give manufacturers the ability to provide high-productivity characterization of a broad range of devices. This includes equipment for ESD compliance testing, efficient pathfinding, advanced imaging and analysis, layer-by-layer device de-processing, laser ablation, and for maximizing yield in the shortest time possible.
Thermo Fisher Scientific provides the broadest portfolio of high-productivity 3D analysis workflows that accelerate development, maximize yields, and ensure the production of high-quality devices that meet current and future industry demands. Explore the pages below to learn how our applications and workflows can address your specific needs.
Applications
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Semiconductor Pathfinding and Development
Advanced electron microscopy, focused ion beam, and associated analytical techniques for identifying viable solutions and design methods for the fabrication of high-performance semiconductor devices.
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Yield Ramp and Metrology
We offer advanced analytical capabilities for defect analysis, metrology, and process control, designed to help increase productivity and improve yield across a range of semiconductor applications and devices.
Semiconductor Failure Analysis
Semiconductor Failure Analysis
Increasingly complex semiconductor device structures result in more places for failure-inducing defects to hide. Our next-generation workflows help you localize and characterize subtle electrical issues that affect yield, performance, and reliability.
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Physical and Chemical Characterization
Ongoing consumer demand drives the creation of smaller, faster, and cheaper electronic devices. Their production relies on high-productivity instruments and workflows that image, analyze, and characterize a broad range of semiconductor and display devices.
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ESD Semiconductor Qualification
Every electrostatic discharge (ESD) control plan is required to identify devices that are sensitive to ESD. We offer a complete suite of test systems to help with your device qualification requirements.
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Advanced Memory Technology
Modern data demands are driving innovation in 3D NAND, DRAM and other memory structures. Our memory analysis tools and workflows offer high-productivity characterization so that manufacturers can meet performance, latency, and capacity demands.
Techniques
TEM MetrologyTEM Imaging and AnalysisCircuit Edit & NanoprototypingSEM MetrologySEM Imaging and AnalysisOptical Fault IsolationThermal Fault IsolationTEM Sample PreparationNanoProbingAtom Probe PreparationLaser AblationDevice DelayeringESD Compliance Testing
TEM Metrology
Advanced and automated TEM metrology routines deliver significantly greater precision than manual methods. This allows users to generate large amounts of statistically relevant data, with sub-angstrom-level specificity, that is free of operator bias.
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Samples
Semiconductor Materials and Device Characterization
As semiconductor devices shrink and become more complex, new designs and structures are needed. High-productivity 3D analysis workflows can shorten device development time, maximize yield, and ensure that devices meet the future needs of the industry.
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Products
Spectra 300
Highest-resolution structural and chemical information at the atomic level
Flexible high-tension range from 30-300 kV
Three lens condenser system
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Spectra Ultra
New imaging and spectroscopy capabilities on the most beam sensitive materials
A leap forward in EDX detection with Ultra-X
Column designed to maintain sample integrity.
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Helios 5 PFIB DualBeam
Gallium-free STEM and TEM sample preparation
Multi-modal subsurface and 3D information
Next-generation 2.5 μA xenon plasma FIB column
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Helios 5 PXL PFIB Wafer DualBeam
PFIB beam current from 1pA–2.6µA
Faster yield learning and increased productivity
Automated handling of 300 mm FOUP with EFEM (GEM300 compliant
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Helios 5 EXL DualBeam
Low-voltage performance for high sample preparation quality
Ultra-high-resolution immersion-lens field-emission SEM column
Automated handling of 300 mm FOUP with EFEM (GEM300 compliant)
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Helios 5 DualBeam
Fully automated, high-quality, ultra-thin TEM sample preparation
High throughput, high resolution subsurface and 3D characterization
Rapid nanoprototyping capabilities
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Talos F200E TEM
High-quality (S)TEM imaging of semiconductor and microelectronic devices
Precise, high-speed chemical characterization with EDS
Dedicated semiconductor-related applications
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Talos F200X TEM
High resolution/throughput in STEM imaging and chemical analysis
Add in situ sample holders for dynamic experiments
Features Velox Software for fast and easy acquisition and analysis of multimodal data
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Metrios AX TEM
Automation options to support quality, consistency, metrology, and reduced OPEX
Leverages machine learning for superior autofunctions and feature recognition
Workflows for both in-situ and ex-situ lamella preparation
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Scios 2 DualBeam
Full support of magnetic and non-conductive samples
High throughput subsurface and 3D characterization
Advanced ease of use and automation capabilities
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ExSolve WTP DualBeam
Can prepare site-specific, 20 nm thick lamellae on whole wafers up to 300 mm in diameter
Addresses needs requiring automated, high-throughput sampling at advanced technology nodes
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Verios 5 XHR SEM
Monochromated SEM for sub-nanometer resolution over the full 1 keV to 30 keV energy range
Easy access to beam landing energies as low as 20 eV
Excellent stability with piezo stage as standard
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Quattro ESEM
Ultra-versatile high-resolution FEG SEM with unique environmental capability (ESEM)
Observe all information from all samples with simultaneous SE and BSE imaging in every mode of operation
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Prisma E SEM
Entry-level SEM with excellent image quality
Easy and quick sample loading and navigation for multiple samples
Compatible with a wide range of materials thanks to dedicated vacuum modes
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Apreo 2 SEM
High-performance SEM for all-round nanometer or sub-nanometer resolution
In-column T1 backscatter detector for sensitive, TV-rate materials contrast
Excellent performance at long working distance (10 mm)
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VolumeScope 2 SEM
Isotropic 3D data from large volumes
High contrast and resolution in high and low vacuum modes
Simple switch between normal SEM use and serial block-face imaging
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Phenom ProX G6 Desktop SEM
High performance desktop SEM with integrated EDS detector
Resolution <6 nm (SE) and <8 nm (BSE); magnification up to 350,000x
Optional SE detector
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Taipan G2+ Circuit Edit System
Imaging and milling resolution to meet 10nm node specifications
Superb etch selectivity and deposition control for conductors and insulators
Excellent navigation and ion beam placement accuracy
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Centrios CE
Superior image / milling resolution
Enhanced milling precision and control
Built on the Thermo Scientific Helios DualBeam platform
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MK.4TE ESD and Latch-Up Test System
Rapid-relay-based operations—up to 2304 channels
Advanced device preconditioning with six separate vector drive levels
Fully compliant Latch-Up stimulus and device biasing
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ELITE System
Completely non-destructive
Quickly identifies defective component on assembly board for accurate dispositioning
Localizes defect in x-y with micrometer accuracy, with depth location accurate to 20 µm
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nProber IV
Localize transistor and BEOL faults
Thermal nanoprobing (-40°C to 150°C)
Semi-automated operation
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Hyperion II System
Atomic Force Probing
Localize transistor faults
Integrated PicoCurrent (CAFM)
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Meridian S System
Fault Diagnostic with Active Probe Technology
Static laser stimulation (SLS / OBIRCH) and photon emission options
Supports both micro-probing and probe card device stimulation
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Meridian WS-DP System
High-sensitivity, low-noise, low-voltage photon emission detection with broadband DBX or InGaAs camera systems
Multi-wavelength laser scanning microscope for scan chain analysis, frequency mapping, transistor probing and isolation of faults
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Meridian 7 System
Dynamic Optical Fault Isolation for 10nm node and below
High resolution visible and Infrared light
High-yield sample preparation to 5μm widely available
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Meridian IV System
High sensitivity extended-wavelength DBX photon emission detection
Standard InGaAs photon emission detection
Laser Scanning Microscope with multiple wavelength options
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Celestron Test System
Wafer and package level TLP testing
High current TLP pulse generato
Can be interfaced with semiautomatic probers
Intuitive software for control and report generation
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Orion3 Test System
Charged device model testing
Dual high resolution color cameras
Test densities to less than 0.4mm pitch
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Pegasus
Testing per the latest industry standards
True system level ESD 150pF/330Ω network
2 pin connection via wafer probes to any device
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AutoTEM 5
Fully automated in situ S/TEM sample preparation
Support of top-down, planar and inverted geometry
Highly configurable workflow
Easy to use, intuitive user interface
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Auto Slice and View 4.0 Software
Automated serial sectioning for DualBeam
Multi-modal data acquisition (SEM, EDS, EBSD)
On-the-fly editing capabilities
Edge based cut placement
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Maps Software
Acquire high resolution images over large areas
Easily find regions of interest
Automate image acquisition process
Correlate data from different sources
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Avizo Software
Materials Science
Support for multi-data/multi-view, multi-channel, time series, very large data
Advanced multi-mode 2D/3D automatic registration
Artifact reduction algorithms
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Ifast Software
Macro recorder for faster recipe creating
Runner for unattended overnight operation
Alignment tools: Image recognition and edge finding
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Inspect 3D Software
Image processing tools and filters for cross-correlation
Feature tracking for image alignment
Algebraic reconstruction technique for iterative projection comparison
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NEXS Software
Auto-syncs position/magnification between NEXS and Circuit Edit system for a more seamless user experience
Connects to most Thermo Scientific tools used for EFA, PFA and Circuit Edit space
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AutoScript 4
improved reproducibility and accuracy
Unattended, high throughput imaging and patterning
Supported by Python 3.5-based scripting environment
