A group of high-tech professionals in the semiconductor industry up with a Chinese Academy of Sciences affiliated enterprise founded Piotech, Inc. in April, 2010. The Company is devoted its business to research, develop, and produce the world leading thin film deposit equipments used in the large scale integrated circuit industry. The Company has undertaken two projects from “National Science and Technology Major Projects” and also was honored one of the “Top 5 Chinese Semiconductor Equipment Enterprise” in 2016 and 2017.
Currently, the Company offers three types of product series: 8-12 inch PECVD series, ALD series, and 3D NAND series. These products are widely applied to the front end and back end process in integrated circuit industry, 3D-TSV, Wave Guide, LED, 3D NAND flash memory, and OLED display etc. The Company has technical service centers in Beijing, Tianjin, Xiamen, Wuhan, Shenzhen, Hefei, Chongqing, and Yangtze Delta Region, and provides 24/7 technical support for the customer.
The Company currently has 300 employees. Out of which, more than 90% are college educated, 41% have master degree. Now fourteen technical and business professionals are serving the Company in all aspects of the business. The Company possessed 100% intellectual property rights including nearly 300 patents. In 2017, the Company was qualified as one of outstanding companies in intellectual property achievement in China.
The Company is located in Hunnan District of Shenyang. Total facility is 40,000 square meters, standing on 13 acres land, consisting of a modern office building, a R&D lab with clean room and manufacturing factory. The factory can initially support the annual production of 100 systems and can be expanded to its full capacity of annual production of 350 systems. This translates to annual business volume of 5 billion RMB. The Company has built a strong network of supply chain worldwide and also certified by ISO9001, ISO14001and OHSAS18001 programs.
Piotech sincerely desires to build a win-win relationship with companies in the industry and together to make significant and positive contributions to semiconductor industry in China and worldwide.
12 inch PECVD PF-300T
Product Introduction:
The PF-300T PECVD system produces a family of dielectric films applied for 40-28nm node semiconductor technology. It is malleable and can be used in 14-5 nm node processing line. The Cost of Ownership (CoO) and performance indicators of PF-300T have met the high standard of international marketing requirement. The systems have been used in the production line for VLSI semiconductor manufacturing and TSV advanced packaging line in a few companies in Chinese territory and in Taiwan.
Product Character:
- Cost of Ownership is below average and performance indicators meet the international market standard of international market requirement
- Configurable to 1-3 Process Modules
- SiO2，SiN，SiON and TEOS SiO2 standard processes are maturely available
- Configurable to 1-3 Precursors
- Low temperature（<200℃） TEOS SiO2 processes satisfied the requirement of TSV technology
- Obtained S2 and F47 certification
- Compatible and interchangeable for 8 inch PECVD system
8 inch PECVD PF-200T
Product Introduction:
PF-200T system is based on the platform of PECVD series. It shares the hardware structure of PF-300T and it has the same level of system stability. It also passed the test of mass-production verification in major fabs in China. Comparing to the similar second hand equipments sold produced by the international maker, PF-200T system holds the advantage of higher throughput and lower maintenance cost. The Company also can provide complete service and processing development support. PF-200T offers the option to be upgraded to 12 inch configuration, or to become switchable for 8 inch or 12 inch configuration. PF-200T system also provides low temperature TEOS SiO2 processes satisfied the requirement of TSV technology in 3D ICs
Product Characer:
-
Cost of Ownership is below average and performance indicators meet the international market standardof international market requirement
- Configurable to 1-3 Process Modules
- SiO2，SiN，SiON and TEOS SiO2 standard processes are maturely available
- Configurable to 1-3 Precursors
- Low temperature（<200℃） TEOS SiO2 processes satisfied the requirement of TSV technology
- Obtained S2 and F47 certification
- S2 and F47 standard tests certified
12 inch PECVD PF-300T
Product Introduction:
The PF-300T PECVD system produces a family of dielectric films applied for 40-28nm node semiconductor technology. It is malleable and can be used in 14-5 nm node processing line. The Cost of Ownership (CoO) and performance indicators of PF-300T have met the high standard of international marketing requirement. The systems have been used in the production line for VLSI semiconductor manufacturing and TSV advanced packaging line in a few companies in Chinese territory and in Taiwan.
Product Character:
- Cost of Ownership is below average and performance indicators meet the international market standard of international market requirement
- Configurable to 1-3 Process Modules
- SiO2，SiN，SiON and TEOS SiO2 standard processes are maturely available
- Configurable to 1-3 Precursors
- Low temperature（<200℃） TEOS SiO2 processes satisfied the requirement of TSV technology
- Obtained S2 and F47 certification
- Compatible and interchangeable for 8 inch PECVD system
8 inch PECVD PF-200T
Product Introduction:
PF-200T system is based on the platform of PECVD series. It shares the hardware structure of PF-300T and it has the same level of system stability. It also passed the test of mass-production verification in major fabs in China. Comparing to the similar second hand equipments sold produced by the international maker, PF-200T system holds the advantage of higher throughput and lower maintenance cost. The Company also can provide complete service and processing development support. PF-200T offers the option to be upgraded to 12 inch configuration, or to become switchable for 8 inch or 12 inch configuration. PF-200T system also provides low temperature TEOS SiO2 processes satisfied the requirement of TSV technology in 3D ICs
Product Characer:
-
Cost of Ownership is below average and performance indicators meet the international market standardof international market requirement
- Configurable to 1-3 Process Modules
- SiO2，SiN，SiON and TEOS SiO2 standard processes are maturely available
- Configurable to 1-3 Precursors
- Low temperature（<200℃） TEOS SiO2 processes satisfied the requirement of TSV technology
- Obtained S2 and F47 certification
- S2 and F47 standard tests certified
12 inch ALD FT-300T
Product Introduction:
FT-300T system is an atomic layer deposition (ALD) system fully designed and developed by Piotech. Processing chamber is built on the PECVD platform, which is highly productive and mass production proven. FT-300T fully realizes and meets the demand of high productivity. FT-300T system has been applied for VLSI
manufacturing, OLED industry, as well as advanced packaging (TSV). Since ALD technology enables a single atomic layer deposition for each processing cycle on a surface, and it could be used in sub 14nm technologies. It provides effective coverage layer to fill deep trenches and holes with high aspect ratio (AR). FT-300T systems are used to produce high quality SiO2, SiN, and Al2O3 thin films. The application of the system can be expanded into metal oxides and metal nitrides area.
Product Character:
- Cost of Ownership is below average and performance indicators meet the international market standardof international market requirement
- Configurable to 1-3 Process Modules
- Excellent film uniformity and conformability
-
Plasma Enhanced ALD (PEALD) and Thermal ALD (T-ALD) configuration
available
- >95% Step coverage for high-aspect-ratio-patterned-deposition (AR>20:1)
- Obtained S2 and F47 certification
12 inch ALD FT-300T
Product Introduction:
FT-300T system is an atomic layer deposition (ALD) system fully designed and developed by Piotech. Processing chamber is built on the PECVD platform, which is highly productive and mass production proven. FT-300T fully realizes and meets the demand of high productivity. FT-300T system has been applied for VLSI
manufacturing, OLED industry, as well as advanced packaging (TSV). Since ALD technology enables a single atomic layer deposition for each processing cycle on a surface, and it could be used in sub 14nm technologies. It provides effective coverage layer to fill deep trenches and holes with high aspect ratio (AR). FT-300T systems are used to produce high quality SiO2, SiN, and Al2O3 thin films. The application of the system can be expanded into metal oxides and metal nitrides area.
Product Character:
- Cost of Ownership is below average and performance indicators meet the international market standardof international market requirement
- Configurable to 1-3 Process Modules
- Excellent film uniformity and conformability
-
Plasma Enhanced ALD (PEALD) and Thermal ALD (T-ALD) configuration
available
- >95% Step coverage for high-aspect-ratio-patterned-deposition (AR>20:1)
- Obtained S2 and F47 certification
12 inch ALD FT-300T
Product Introduction:
FT-300T system is an atomic layer deposition (ALD) system fully designed and developed by Piotech. Processing chamber is built on the PECVD platform, which is highly productive and mass production proven. FT-300T fully realizes and meets the demand of high productivity. FT-300T system has been applied for VLSI
manufacturing, OLED industry, as well as advanced packaging (TSV). Since ALD technology enables a single atomic layer deposition for each processing cycle on a surface, and it could be used in sub 14nm technologies. It provides effective coverage layer to fill deep trenches and holes with high aspect ratio (AR). FT-300T systems are used to produce high quality SiO2, SiN, and Al2O3 thin films. The application of the system can be expanded into metal oxides and metal nitrides area.
Product Character:
- Cost of Ownership is below average and performance indicators meet the international market standardof international market requirement
- Configurable to 1-3 Process Modules
- Excellent film uniformity and conformability
-
Plasma Enhanced ALD (PEALD) and Thermal ALD (T-ALD) configuration
available
- >95% Step coverage for high-aspect-ratio-patterned-deposition (AR>20:1)
- Obtained S2 and F47 certification
12 inch 3D NAND NF-300H
Product Introduction:
The NF-300H system is developed specifically for the new generation 3D NAND memory fabrication. NF-300H system enables a 128-pairs of SiO2、SiN(ONON) gate stacks deposition. It combines particle contamination control, thin film roughness control, stress control and production- proven system protocol to deliver superior performance. The system achieved the above mentioned four critical indicators and peered with the similar products in the international market. It is production ready and has the competitive advantage in the market place. The Company possesses 100% intellectual property rights.
Product Character:
- Cost of Ownership is below average and performance indicators meet the international market standardof international market requirement
- Configurable to 1-3 Process Modules
- Consistent film quality and processing performance
- Fast switch function between processes with high- throughput
- Meet the requirements of high temperature deposition under 300-600 ℃
- Multi layer manifold showerhead design for fast precursor switch
- Obtained S2 and F47 certification
12 inch 3D NAND NF-300H
Product Introduction:
The NF-300H system is developed specifically for the new generation 3D NAND memory fabrication. NF-300H system enables a 128-pairs of SiO2、SiN(ONON) gate stacks deposition. It combines particle contamination control, thin film roughness control, stress control and production- proven system protocol to deliver superior performance. The system achieved the above mentioned four critical indicators and peered with the similar products in the international market. It is production ready and has the competitive advantage in the market place. The Company possesses 100% intellectual property rights.
Product Character:
- Cost of Ownership is below average and performance indicators meet the international market standardof international market requirement
- Configurable to 1-3 Process Modules
- Consistent film quality and processing performance
- Fast switch function between processes with high- throughput
- Meet the requirements of high temperature deposition under 300-600 ℃
- Multi layer manifold showerhead design for fast precursor switch
- Obtained S2 and F47 certification
12 inch 3D NAND NF-300H
Product Introduction:
The NF-300H system is developed specifically for the new generation 3D NAND memory fabrication. NF-300H system enables a 128-pairs of SiO2、SiN(ONON) gate stacks deposition. It combines particle contamination control, thin film roughness control, stress control and production- proven system protocol to deliver superior performance. The system achieved the above mentioned four critical indicators and peered with the similar products in the international market. It is production ready and has the competitive advantage in the market place. The Company possesses 100% intellectual property rights.
Product Character:
- Cost of Ownership is below average and performance indicators meet the international market standardof international market requirement
- Configurable to 1-3 Process Modules
- Consistent film quality and processing performance
- Fast switch function between processes with high- throughput
- Meet the requirements of high temperature deposition under 300-600 ℃
- Multi layer manifold showerhead design for fast precursor switch
- Obtained S2 and F47 certification
Technical Support Service and Spare Parts
Customer Technical Support：
-
During the warranty period, the Company will provide on time customer repair and maintenance service without charge (not including the problems caused by human errors) to assure the continuation of normal operation in customer’s production
site.
-
During the warranty period, the Company will provide sufficient spare parts free of charge to the customer. The customer can purchase the needed spare parts from Piotech after the warranty period expires.
-
Piotech guarantees that its technical support engineers will arrive customer site within 24 hours upon receiving the request from customer.
Technical Support Service and Spare Parts
Customer Technical Support：
-
During the warranty period, the Company will provide on time customer repair and maintenance service without charge (not including the problems caused by human errors) to assure the continuation of normal operation in customer’s production
site.
-
During the warranty period, the Company will provide sufficient spare parts free of charge to the customer. The customer can purchase the needed spare parts from Piotech after the warranty period expires.
-
Piotech guarantees that its technical support engineers will arrive customer site within 24 hours upon receiving the request from customer.
