Unparalleled Benefits of Mobile Electrostatic Carriers
High Throughput
Room temperature bond/debond in seconds enables rapid throughput for R&D, pilot line or high volume manufacturing

Extraordinary Yield
Near perfect yields due to damage-free, delicate release

Easy & Clean
Easy, user-friendly bonding with no intermediate layers, no adhesives and no extra clean steps

Ultra Low Cost
Single tool and reusable carriers provide lowest total cost of ownership in the industry

Handles any shape and 100mm, 150mm, 200mm and 300mm substrates to less than 50 micron wafer thickness

Temporary bonding has emerged as a mission-critical application for production of today's advanced devices in Semiconductor, Automotive, Defense, Quantum Computing, Biomedical and other industries.

Eshylon's new, patented Mobile Electrostatic Carrier (MESC) platform enables leading-edge device fabrication by providing a rigid but mobile platform for handling challenging substrates in an R&D, pilot line or high volume manufacturing environment.

Utilizing electrostatic forces, Eshylon carriers can bond in seconds to a target substrate for processing then release the substrate gently without the need for additional clean steps or adhesives, all on a single tool.


Eshylon technology solves complex handling problems across mission-critical applications
Facility Bridge (Multiple Size Substrates)
Traditional production tools are configured and optimized for standardized wafers ranging from 100mm to 300mm, and can only process one wafer size without significant costly upgrades. Eshylon MESCs overcome this limitation, enabling dramatic ROI through reuse of 300mm or 200mm tool sets for smaller substrates bonded to Eshylon carriers.
Reuse of any pre-existing toolset for small substrate handling

Available in identical form factor of all SEMI-specified silicon wafer sizes

Rapid & versatile conversion of existing capital equipment to new handling requirements

Thin Wafer Handling
With mobile devices forcing miniaturization of packaged ICs, device thickness must be reduced dramatically. Backside thinning of ultra-thin and delicate substrates presents serious wafer handling challenges that Eshylon solves. Good bye breakage, low yields and slow throughput.
Fast, high throughput processing with instant, delicate release

Variable bonding voltage to optimize bonding and release of thin or delicate 3/5 materials

High yields and extraordinarily versatile handling applications

Device Packaging
With 2.5 and 3D packaging applications, device handling challenges have diversified. Eshylon has experience with development of custom packaging-handling applications and form factors, providing application-specific mobile device carriers that can be used in applications such as:

Plasma and flux cleaning

Loading & unloading into pick-and-place tools

Various other high-temperature cure processes


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