ACCESS was established in 2006 as a Sino-Israeli joint venture. ACCESS is the world leader in advanced organic coreless substrate technology and is the first company in the world to apply VIA POST technology in mass production of coreless substrates. ACCESS has been recognized as “National Innovation Company”, “Privately-owned Hi-Tech Enterprise of Guangdong Province”, and “Enterprise with Intellectual Property Advantage of Zhuhai” by China central or local government, and its R&D Center won the 2nd prize of “Guangdong Science & Technology Award of 2013” for its highly reliable RF Module Coreless Substrate Technology. On July 31st, 2012 the company rebranded itself as Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co., Ltd.
With world leading VIA POST technology and the know-how of applying this technology in advanced, low cost coreless substrates production, ACCESS is fully equipped to satisfy the need for high density, high efficiency, high speed, low energy applications of today’s advanced packaging designs. The company currently possesses many patents in China, USA, South Korea, and Israel, with numerous patents under application across the world. ACCESS’ success in industrializing VIA POST technology in coreless substrate production has broken the monopoly of leading global IC substrate manufactures, and is seen as a major breakthrough in substrate development for China’s semiconductor industry moving “Made in China” to “Innovated in China”.
Embedded Passive
Description: ACCESS has developed thin film capacitor technology for embedded passive or IPD design into substrate. EPS technology has been passed reliability test by customers. The characteristics of EPS technology are better signal integrity, lower signal noise and thinner package size.
Applications: Portable device, graphic and network products
Embedded Active
Description: ACCESS has developed seamless Die to package interconnects solution with patented via-in-frame, an alternative solution of low cost and high performance assembly solution with Access mature panel level substrate, no need wafer bumping, no any laser via, shorten fab to package and time to market, using thicker copper RDL and via or bar-via post .
Applications: Power, Sensor, GaN, Regulator, RF wireless, etc
Any-Shape Any-Layer Bar via post
Description: ACCESS provide minimum > 40um via, and also any shape bar via post in any layer. All via post are with vertical and smooth surface without any dimple, which can bring excellent RF performance and best heat dissipation.
Applications: High Power, High Speed, High Frequency, GaN, CPU, GPU, PMU, IoT, VR, AI, etc
Hybrid Substrate
Description: This is a flexible dielectric material design for high frequency product. It is also suitable for high – density layout design, ACCESS can provide,
Odd or Even Layers
Prepreg and Film Combinations
BoT, BoP, Cu Stumps, Sn μBumps
Solder Mask: Wet, Film, PS & Non PS
Via: Ultra fine, Oblong, Bar, Stacked
OSP, Ni/Au, Thin Ni ENEPIG, ULA Sn
Embedded Trace
Description: ACCESS provides embedded trace technology for low layer counts substrate requirement. It can be applied to 2 ~ 4layers substrate and the current line/space capability for embedded trace technology is 15/15um.
Ultra Thin dielectrics
Description: ACCESS can provides minimum 20um or 25um to all dielectric thickness by unique coreless technology, it is suitable to apply 2 ~ 18 layers.
Bond on Pillar (BoP)
Description: ACCESS provides BoP technology that was developed to meet flip chip substrate’s ultra fine bump pitch requirements; it is available to apply for 90um bump pitch. ACCESS can also provide oblong bump to apply into BoT (Bond on Trace) design to get better assembly yield.
BoP TD (Thin Down)
Description: ACCESS also provides BoP Thin Down technology, there is 7um min Cu height above the solder resist material.
SLCS
With Carrier
Description: Flexible design, ultra thin and low cost with excellent thermal and electrical performance coreless substrate with carrier provides customer robust structure to gain better assembly yield, the overall thickness of substrate can achieve min. 45um and suitable for BGAs, LGAs and QFNs, the product needs to have back-etched process after assembly.
Applications: recommended for High Performance CPU, GPU, ASIC Devices for Consumer/ Portable / Game Console
Without Carrier
Description: Flexible design, ultra thin and low cost with excellent thermal and electrical performance coreless substrate, assembly house can apply it directly without back-etched process. It is suitable for 1L/1.5L and min. thickness can achieve 45um.
Applications: recommended for High Performance CPU, GPU, ASIC Devices for Consumer/ Portable / Game Console
2Layers
Double Sided
Description: Conventional like 2L substrate with flexible design by ETS coreless technology with excellent thermal heat dissipation by Cu pillar technology, it is suitable for wire bonding BGA and fcCSP.
Applications: Consumer/ Portable /Networking/High Power
Ultra Thin Dielectric
Description: ACCESS can provide ultra thin 2L substrate with 25um dielectric thickness and overall thickness is 85um. It is available for fine pitch design by ETS technology to W/B BAG and fcCSP application.
Applications: Consumer/ Portable /Networking/High Power
3Layers
Ultra Thin Dielectrics
Description: ACCESS can provide ultra thin 3L substrate with 25um dielectric thickness and overall thickness is 125um. It is available for fine pitch design to W/B BAG and fcCSP.
Applications: Consumer/ Portable /Networking/High Power
3layers to 18layres
Even layer
Description: ACCESS provides a unique coreless technique to realize ultra thin thickness and fine line design with excellent thermal heat dissipation by Cu pillar technology and good electrical performance due to the short electrical path between layer to layer. It allows a flexible design rule and full stacked-via technology.
4 layers
6 layers
8 layers
10 layers
18 layers
Odd layer
5 layers
7 layers
9 layers
Applications:
CPU, GPU and Chipset for Desktop / Game Console
DTV Chip Controller, Blu-Ray Chip Controller
Networking / Portable
ASICs
PA Module, Blue Tooth GPS for Wireless / Communication
