Innovative solutions for semiconductor production
As a global leader in technology, RENA Technologies GmbH offers integrated production systems for wet chemical surface treatment. This encompasses automatic and manual wet processing systems for producing semiconductor products for all manner of different sectors. These innovative solutions can be used in FEOL and BEOL applications to produce prime wafers, chips, and MEMS, to plate all manner of different substrates, and for reel-to-reel processing.
Wafering
RENA offers automatic wet processing systems with a carrierless option and flexible input and output solutions for etching and cleaning. They are designed to support high throughput rates and precise process control.
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Batch Immersion
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Batch Spray
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Electro-Plating
RENA platforms for metal plating boast a high degree of flexibility and a modular design. They facilitate manual and automatic plating with pure metals and alloys of Au, Ag, Cu, Sn, Ni, or SnAg on a variety of substrates.
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Wafer Drying
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Single Wafer Processing
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Chemical Delivery Systems
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Parts Cleaning
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Sapphire Crackle Cleaning
Batch Clean is developed for cleaning sapphire crackle from metal contaminants. The platform is designed for producers of sapphire using crackle for the growth of sapphire crystals. The equipment is adapted to different cleaning media and can be scaled-up according to different customer demands.
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Automatic and manual wet processing systems
RENA’s manual wet processing systems support small- and very small-scale production of chips in accordance with precisely adjustable and logged process parameters. This allows them to supply research departments with key figures for developing new products and meeting individual customer requirements.
RENA’s automatic wet processing systems support continuous series production of chips and MEMS with a process guarantee. The innovative production machinery handle all wet processes for front-end-of-line (FEOL) and back-end-of-line (BEOL) production.
