Wet Stations

Semiconductor: FOUP Cleaner, POD Cleaner, Wet Station, Chemical Delivery Supply System, Metal Lift Off, Cassette & Magazine Cleaner. Display: OLED Mask Cleaner, Glass Cleaner, Etcher & Stripper, Auto Macro Inspection, Stream-Jet Printing, Lamination M/C,

CMP (Chemical Mechanical Polishing), Wet Cleaning Systems. Display Equipment: Wet Station, APP (Atmospheric Pressure Plasma Cleaner), CO₂Cleaner, Coater & Track System. CMP Slurry and nano dispersion solution

Semiconductor: Wet Etching & Cleaning Solutions RTP(Rapid Thermal Processing). Display: Thermal Process Solutions In-Line Solutions, Inspection Process Solutions. Robotics.

High-end wet process equipment supplier

Photolithography equipment, Photomask making equipment, Chemistry equipment, Washing and drying equipment for wafers and substrates, Vacuum and plasma equipment, Control, Testing and Measuriung equipment, Solar cell test equipment, Local clean zones.

Wet process equipment, scrubber, cleaning/drying equipment, quartz products

manual, semi-automated and fully-automated dry In / dry out wet benches and wet chemical process equipment used in the manufacturing of microelectronic devices, MEMS devices, computer disc drive media and slider assemblies, flat panel displays and PV.

Wet process stations, Resist processing equipment, Dicing equipment, PCB processing equipment

Mask Aligner, Total Lithography Solution, Spin Coater System, Mask Spin Cleaning System, Wet Station System, Exposure System, Glass Scribing Machine

PCB, Photo Chemical Milling (PCM), Surface Finishing, Thermal Processing Furnaces and Ovens, Automation Equipment. Solar production equipment.

Equipment, systems & components for semi- and fully automatic wafer processing. Engineering, refurbishment & repair of optical, mechanical & electromechanical components.

Machines, plants and systems in the area of vacuum coating technology, surface processing, wet-chemical as well as thermal processing technology.

Surface preparation equipment and processes, including WET BATCHSPRAY systems for the III-V semiconductor, MEMS, wireless, power, energy harvesting, WLP, data storage and logic industries.

WET CHEMICAL TURN-KEY SOLUTIONS. ELECTROPLATING / ETCHING-CLEANING ECES for 3DIC﹐ TSV﹐ RDL﹐ Copper pillar﹐ Au bump application.

Wet processing and chemical system R&D, manufacturing and integration

Wet Progress and Chemical Delivery System for Microelectronics

Wet processing systems and related components

Ultra-pure chemicals, lead frames treatment and post packaging treatment chemicals, equipment for the relevant processes: through Silicon Via, Micro-Bumping, MEMS, Solar Cells and other wafer level plating materials.

Step Height Profiler for FPD, NanoSpec 6500 series, Wafer thin film stress measurement system FLX-2320-S, Wafer surface analizer Candela CS series (manufactured by KLA-Tencor), Wet process equipment for semiconductor and LCD industry

Ultrasonic Cutting System, Polish Cut System, Single Wafer Wet Processing System, Dicing Frame Cleaner, Batch Process Automated Wafer Cleaning Systems, IPA Vapor Dryers