SEMSYSCO GmbH

GALAXY BATCH WAFER PLATFORM
With the Galaxy batch wafer processing, we combined years of experience with batch wafer processing with the cutting edge of process control typically only found on single wafer tools.

Additionally, this platform is suited to grow with your process needs and both enables you to start prototype application as well as run mass production processes.

MODULAR DESIGN
The modular approach to the batch tool gives you all the potential configurations that satisfy your processing requirements. From a single chamber manual tool, to a two, four, or even eight chamber fully automated tool, with a mix of solvent or acid processing chambers, the basic tool remains the same, and layers of functionality are added on.

Best of all, within the same tool you can use carriers for manual cassette loading, and change over to guardian carriers for full automation. By changing the carrier you can also easily run different substrate sizes.

ADDITIONAL FEATURES
An additional feature is the adding on of immersion tanks to allow the electro-less deposition of metals. Our Galaxy-EL features pre-treatment, rinse-dry batch chambers as well as the tanks necessary to deposit metals very thin and very homogeneously, while offering superior bath life, minimal drag out and excellent uniformity.

MANUAL GALAXY
Manual batch processing
AUTOMATED GALAXY
Automated batch processing
E-LESS GALAXY
Manual or automated batch processing
GALAXY CUSTOMER ADDED VALUES
Identical chambers for manual and fully automated tools in the modular platform
Outstanding automation reliability and speed
Customized to our customer’s needs
Possibility of processing more than one substrate size per chamber with change of carrier
Electroless plating can be added optionally to the Galaxy Platform
Upgrade- and future-proof
Established high-throughput processing chambers
GALAXY HIGHLIGHTS
Processing of 3” to 300 mm substrates
Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber
Industry 4.0 ready – control and monitor all process parameters similar to a single wafer tool
Etch uniformity 3% or better
Online dosing system
Online chemical monitoring
Online gas detection for safety
End-point detection for many etch processes

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APPLICATIONS
SURFACE PREPARATION

Cleaning
Resist stripping acid
Resist stripping solvent
Polymer removal
O3 clean
Lift off
Alu etch
Cu etch
UBM etch
Si etch
SiO2 etch
Ni etch
Sacrificial layer etch
Wafer thinning
Damage removal
HF Vapor
Au etch
Ga etch
Glass etch

TRITON SINGLE WAFER PLATFORM
From its inception to the first delivery in 2013, the Triton platform was designed to be a stable but modular workhorse for all single-wafer wet-processes.

The modular build of our tools enables our customer to configure the tool for a mass-production single-process tool as well as a swiss-army knife R&D or prototyping tool – without affecting performance or reliability.

FRAMEWORKS
Within the modular frame-work, we keep innovating the platform.

Our customers can choose to equip their tool with the High-Speed Plating System in favor of a traditional fountain plater, or with an upper chamber that allows pre-wetting as well as a final rinse/dry above the plating chamber without needing a robot move.

FLEXIBILITY
We provide our customers with the most flexibility. Tools can be made ready to support additional chambers and/or tanks, so it will grow with your process needs. Our modular thinking makes it possible that newly developed chambers can be added to existing tools with space for expansion, future-proofing our customer’s investment.

AUTOMATED TRITON
For production purpose
SEMI-AUTOMATED TRITON
For pilot line purpose
TRITON CUSTOMER ADDED VALUES
Excellent speed and quality track record
Custome- and future-proof
Highly innovized to our customer’s needs
Possibility of processing more than one substrate size per chamber with minimal or no reconfiguration
Modular platform
Upgradative new wet processes
Established high-throughput processing chambers
TRITON HIGHLIGHTS
Processing of 3” to 450 mm substrates
Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber
Patented High-Speed Plating for better throughput and better uniformity – without changing the chemistry
Industry 4.0 ready – control and monitor all process parameters
Plating uniformity 3% or better
Etch uniformity 3% or better
Online dosing system
Online chemical monitoring
Online gas detection for safety
End-point detection for many etch processes

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APPLICATIONS
ELECTRO CHEMICAL DEPOSITION

Cu RDL layer
Cu tall pillar
Cu Bumb
Cu –Ni- SnAg , Cu-SnAg
Cu- Ni- Au
SURFACE PREPARATION

UBM etch
E-less activation and platingResist develop
Resist strip
Lift off
Si etch
Wafer thinning
Damage layer removal
KOH etch
Seed layer deposition
Barrier layer deposition

VHS-P VERTICAL PANEL PROCESSING
Our newest platform was introduced in 2016 to process panels larger than 300x300mm² in vertical chambers. Where the high -speed plating system allowed us to achieve already superior uniformity and plating speeds on single wafer substrate in a horizontal configuration, the vertical chamber is where this system truly shines.

PLATING ELECTROLYTE
Through careful and uniform injection of the plating electrolyte near the surface and the linearization of the electric field at the same time, it is the only system that makes fine line plating feasible on large / very large substrates.

PHOTORESIST STRIP/DEVELOP AND UBM ETCH
Knowing that plating is just one step in the whole wet process of the panel, we also offer a complete photoresist strip / developer and seed and barrier layer etch program to enable all kinds of RDL (redistribution layer) processes for your packaging needs.

AUTOMATED VHS-P
For production purpose
SEMI-AUTOMATED VHS-P
For pilot line purpose
MANUAL VHS-P
For lab purpose
VHS-P CUSTOMER ADDED VALUES
The ideal platform for fine-line plating on large substrates up to Gen5.1
Customized to our customer’s needs
Two substrates processed at once per chamber for higher throughput
Full suite of wet processes for RDL packaging applications
Modular platform
Upgrade- and future-proof
Highly innovative new wet processes
Established high-throughput processing chambers
VHS-P HIGHLIGHTS
Processing of 300x300mm² up to Gen5.1 substrates
Deposition of extremely uniform metal structures.
Patented High-Speed Plating for better throughput and better uniformity – without changing the chemistry
Industry 4.0 ready – control and monitor all process parameters
Plating uniformity 5% or better
Etch uniformity 5% or better
Online dosing system
Online chemical monitoring
Online gas detection for safety
Multipoint end-point detection for many etch processes