Tango Systems, Inc. is based in the heart of Silicon Valley and is a leading innovator in high performance, cost-effective physical vapor deposition (PVD) systems. Tango is at the forefront of 5G EMI, Panel Level Packaging, and Backside Metallization (BSM). Tango has exemplified leadership in panel level processing providing a versatile platform for all formats: Wafer, Reconstituted Rings and Panel. Tango tools are field proven with more than 10 years of production globally.
Over the last decade, Tango’s flexible Axcela™ 200/300 series has supplied tools for manufacturing in the Advanced Packaging, Hard Disk Drive (both Magnetic and non-Magnetic films), Ultra-thin films, Interposers and TSV markets, all with the industry’s lowest Cost of Ownership. The unique Small-Batch-Cluster architecture, coupled with the patent protected D-Source magnetron technology and unique ICP clean configuration make the Axcela™ 200/300 series tools the most flexible, reliable, and cost-effective systems in their class, capable of depositing anywhere from 10 angstroms to 10 microns with ease.
