Breakthrough solutions enabling nano imaging and analysis for semiconductor and material science industries.
Experts in sample preparation of crystalline, soft materials and powders for SEM, STEM, TEM and other types of physical and structural analyses.
cleaving, wafer cleaving, silicon wafer cleaving, die cleaving cross-sectioning, SEM analysis
Kaohsiung City Taiwan
Austin United States
Nanjing Shi China
Danvers United States