WEP

PROCESS CONTROL SOFTWARE BOND

The software BOND is used to operate bond testers in a strict but widely configurable sequence
in order to gather, evaluate, control and present the data for Statistical Process Control (SPC).

CONTROL SYSTEMS: MODCON, MODVIS, PR2, MPC

High temperature furnaces need sophisticated and highly reliable temperature control, especially if they are used for processes lasting several months (e. g. production of crystals or hi tech glass and ceramics).

	The control system MODCON may be used to control several (up to 30) different heat zones of a furnace. The complete system may be operated and supervised in a user friendly way using the Process Visualization software MODVIS. For smaller applications the controller PR2 is available as a 2 zone temperature controller in a DIN 96x96 housing.


	The modular power controllers MPC20 and MPC32 may be used to control the heat current in applications where high precision is required, or where high temperature heaters must be started up cautiously.

WAFER PROFILER CVP21

The Wafer Profiler CVP21 is a handy tool to measure doping profiles in semiconductor layers by Electrochemical Capacitance Voltage Profiling (ECV-Profiling, CV-Profiling) in semiconductor research or production.
This ECV Profiler (CV-Profiler, C-V-Profiler) furthermore is a very good choice to analyze or develop strategies for Photo-Electrochemical Wet Etching (PEC-Etching) of semiconductors.