PROCESS CONTROL SOFTWARE BOND
The software BOND is used to operate bond testers in a strict but widely configurable sequence
in order to gather, evaluate, control and present the data for Statistical Process Control (SPC).
CONTROL SYSTEMS: MODCON, MODVIS, PR2, MPC
High temperature furnaces need sophisticated and highly reliable temperature control, especially if they are used for processes lasting several months (e. g. production of crystals or hi tech glass and ceramics).
WAFER PROFILER CVP21
The Wafer Profiler CVP21 is a handy tool to measure doping profiles in semiconductor layers by Electrochemical Capacitance Voltage Profiling (ECV-Profiling, CV-Profiling) in semiconductor research or production.
This ECV Profiler (CV-Profiler, C-V-Profiler) furthermore is a very good choice to analyze or develop strategies for Photo-Electrochemical Wet Etching (PEC-Etching) of semiconductors.