Semiconductor tape is mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple.
Furukawa Electric also carries dicing die attach film—which combines dicing tape with die attach film used to attach semiconductor chips to substrates and other objects—and continues to earn the praise and trust of customers with its technologies that enable the design, development, and manufacturing of proprietary “die attach film, adhesive, and backing layers.”
Copper and copper alloy products is the general name for things like copper and copper alloy plates, strips, wires, rods and pipes, etc., made using either hot or cold deformation processing such as rolling, drawing, extrusion or forging, etc., and because they have excellent electrical and thermal conductivity, they are used widely in various electrical and electronic devices, and in the automobile and energy transmission areas.
Furukawa Electric leads the world with high productivity, short delivery times and high quality due to uniform production from casting to final products, including being the first company in the world to succeed in the manufacture of oxygen-free copper in a shaft furnace. In addition, Nikko Works is manufacturing copper and copper alloy products with renewable energy from the company’s own hydroelectric power, also contributing to the realization of a sustainable low carbon society.
UV/Non-UV Tape for Bumped Wafer Back Grinding
SP5207M-425/CP9206M-430
Non-UV Tape for Wafer Back Grinding
CP9003B-205B
UV Tape for Thin Wafer Dicing
UC3044M-110B
UV Tape for Package Dicing
FC-217M-170
UV Tape for Optical Product
UC3160M-95
DAF for Die to Substrate
AFN-301
DAF for Die to Die
AFN-303
DAF for FOW
AFN-601
