Jingfeng Electronic Packaging Materials (Wuhan) Co., Ltd. (hereinafter referred to as "Jingfeng Material") is a research and development, production and sale of high-end integrated circuit packaging materials (mainly used for semiconductor packaging high-end packaging materials), display and touch screen bonding Materials, smart card packaging materials and provide technical advisory services related to high-tech enterprises, from the United States returned to the high-level research scientists founded, located in the national independent innovation demonstration area - Hubei Wuhan East Lake High-tech Zone