In 2001, Youngchang Chemical was established and entered a semiconductor process materials business, and has been engaged in continuous R&D investments, key technical personnel fostering, and manufacturing-based investment expansion. Through all this, we have developed and commercialized a pattern collapse prevention solution in the ArF process by using special surfactants and polymers in relation to the semiconductor process materials in the cutting-edge field. Based on the built up technology, we have developed a pattern collapse prevention solution for EUV process and a developer for EUV process in 2016. In addition, we have developed cleaning solutions to improve photo mask developer’s developing capability and profile, prevent capacitor’s collapse, and help cleaning, and various KrFs by which high thickness and high resolution are possible, i-line photoresists, BARC, SOC, CMP slurries, and thinner. In this manner, we have been committed to diversifying semiconductor materials and developing new materials, and have been contributing to the Korean semiconductor industry’s development and innovation. We at Youngchang Chemical will do our very best to provide semiconductor materials in order to maximize customer satisfaction based on customer reliability.
Youngchang Chemical (YCCHEM) entered the display process materials business in 2001, and has continuously been growing through persistent R&D investments, key technical personnel fostering, and manufacturing-based investment expansion. We are developing products depending on the miniaturization process and demand for new products in the display industry, and have localized some of the products by successfully entering some layers. Currently we are supplying display materials (photoresist, UV implant resin, stripper) to domestic and foreign customers. YCCHEM will endeavor for the localization of display process materials through continuous product development and for making a bridgehead to enter the global markets.
Youngchang Chemical entered the relevant industry in 2010 under the business philosophy “Realization of eco-friendly products production,” and has been striving to develop state-of-the-art materials required in the eco-friendly energy industry through continuous investment and development. We have currently completed the development of solar cell process materials (water-soluble cooling oil for cutting, dispersion additive for SiC, detergent, water-soluble cutting oil), and are supplying them to domestic and foreign customers. The eco-friendly energy industry, in which the importance of environmental preservation value emerges in the modern society, is a futuristic industry with an unlimited development possibility. YCCHEM will become a spearhead in the cutting-edge material field of eco-friendly energy through persistent product development efforts.
Semiconductor
AllI-Line PhotoresistBump PhotoresistKrF PhotoresistTSV Thick PhotoresistBARCTARCDeveloperEtchantPromoterRinsing SolutionSpin On Carbon HardmaskCMPWafering
A Total of 62 hit(s)
Subject
Wafering
Wafering is a process of making silicon crystal into wafer. The process is generally performed by a multi-wire saw, which cuts multiple wafers concurrently of the same crystal. Eventually, the wafer is polished to the desired evenness and thickness
CMP
CMP (Chemical Mechanical Planarization or Polishing) is used in all semiconductor processes: making the insulation films different even due to element wiring or separating the element wiring by distributing the slurry containing hundreds of nm size polishing abrasives on the polishing pad surface. This induces the film's chemical reactions, and mechanically removing the transformed film surface by rotating the wafer-supporting polishing carrier and the polishing plate with the polishing pad attached at a high speed, when the wafer is stuck to the polishing pad with poly-urethane.
Spin On Carbon Hardmask
As the pattern size of a semiconductor element is reduced, if the thickness is reduced using the existing PR in implementing a pattern of less than 70nm, when the pattern is engraved at the depth required in the etch process, there is a possibility of the photoresist collapsing. To improve this, an SOC polymer is used. Although the pattern is engraved on the SOC polymer layer at the depth required for the each process using the photoresist, this can be used as a support material to prevent a photoresist collapse.
Rinsing Solution
As a material used in the photo process, this is a material used to prevent pattern damage that occurs while rinsing with D.I. water, after the developer process.
Etchant
This is a material used to remove unnecessary metals existing on the PCB through chemical reactions.
Developer
As a material used in the last stage of the photo development process, this product is a material used in the process of forming patterns on the circuit by selectively removing the exposed areas and non-exposed areas.
TARC
The even pattern can only be formed if the reflectivity is maintained at less than 1%, while the exposure process is being carried out by the reduction of the pattern size of the semiconductor element (Top Anti Reflective Coating). This is used to improve the reflective light and diffused reflection occurrence within the photoresist film during the pattern forming using lithography by treating the prevention film of reflection on the top part upon exposure.
BARC
The even pattern can only be formed if the reflectivity is maintained at less than 1% while the exposure process is being carried out by the reduction of the pattern size of the semiconductor element (Top Anti Reflective Coating). During the pattern forming using lithography, the product is a light absorption agent used for the prevention of reflection and refined wave removal through the lower part of the film layer, and is an organic reflection prevention film.
TSV Thick Photoresist
We have developed and commercialized photoresists for various packaging processes including the latest technology. The photoresists for packaging processes can be used for extensive production technologies such as wafer level RDL and TSV.
KrF Photoresist
We manufacture KrF photoresists for process application with 0.30um to 12.0um of film thickness in relation to 248nm wavelength. In the KrF photoresist product line, we manufacture both positive and negative type photoresists. If you are looking for a krF photoresist solution for project development, we will provide more specific data for the product line when you make an inquiry to us.
Bump Photoresist
We supply positive and negative tone photoresists designed to meet the narrow pitch of related products, such as the recently developed wafer level packaging, MEMs, and 3D photolithography. The photoresist is compatible with various metals' plated chemicals including copper, pure tin, and nickel.
I-Line Photoresist
We manufacture i-line photoresist products for process applications with film thickness from 0.1um to 6.0um in relation to 365nm wavelength. We manufacture positive and negative type i-line photoresist solutions in the i-line photoresist product line-up. If you are looking for an i-line photoresist solution for project development, we will provide more specific data on the product line-up when you make an inquiry to us.
AYCKP-9160
-Target : Thickness 6.0um (Res. 5.0um, Contact Hole)
-Purpose of use : KrF Positive TSV Devices
YSO-800
YSO-800 is an oil-based cutting fluid used in wafer cutting, ensuring excellent cooling, lubricity, extreme pressure, and rust resistance functions. It also has excellent effect on maintaining appropriate viscosity and compressive sedimentation prevention of SiC slurry.
YPCC-2000
Cleaning the wafer surface contamination and anti-corrosion control after the CMP process.
Display
AllTransparent PhotoresistUV Imprint ResinStripperLEDLCD
A Total of 25 hit(s)
Subject
LED
This polymer material enables a response to a specific wavelength's light and specific patterns to be copied. It is also used in the exposure (lithography) process among the TFT-LCD circuit element processes.
Stripper
This is a material used to remove impurities remaining after the etch process.
UV Imprint Resin
NIL (Nanoimprint Lithography) offers the precise and low cost lithography technology for the polymer nano structure's high-throughput patternization.
Transparent Photoresist
For an organic insulator, the level of the leakage current is low, the hysteretic characteristics are low, the patterning is possible through cross-linking, and stability can be provided to an organic solvent. The inorganic interface layer protects the organic insulation film which is used as a sensor in the sensing environment, and provides a material that improves the bonding with an organic semiconductor.
YMR-2100
A material used to remove impurities existing after the etch process.
DV-2379LC
As a material used in the last stage of the photo development process, it is used for performing the process in which patterns are formed in the circuit by selectively removing the exposed and non-exposed areas.
LCR-Y110N / LCR-Y200A / CL-Y300A
In the mechanism of the photoresist composition, acid is formed in the photo acid generator that gets light from the exposure process, and the acid causes the resin's acid catalysed reaction in the photoresist. When using the negative photoresist, a bridging reaction occurs, and patterns are formed with solubility difference of the developer (development liquid) in the exposed and non-exposed areas through the reaction.
SCR-100
In the mechanism of the photoresist composition, acid is formed in the photo acid generator that gets light from the exposure process, and the acid causes the resin's acid catalysed reaction in the photoresist. When using the negative photoresist, a bridging reaction occurs, and patterns are formed with solubility difference of the developer (development liquid) in the exposed area and non-exposed area through the reaction.
LCD
This polymer material enables a response to a specific wavelength's light and specific patterns to be copied. It is also used in the exposure (lithography) process among the TFT-LCD circuit element processes.
PSS-Wafer-Foundry-Service
Forms micro patterns with a sharp shape at the upper part through plasma etching the sapphire wafer surface to improve the luminous efficiency of the LED.
YPS-3000
A material used to remove impurities that exist after the etch process.
YPS-1000
A material used to remove impurities that exist after the etch process.
DV-2379
As a material used in the last stage of the photo development process, the material is used for performing the process in which patterns are formed in the circuit by selectively removing the exposed and non-exposed areas.
YNP-4000L
In the mechanism of the photoresist composition, acid is formed from the photo acid generator that gets light from the exposure process. Also, the acid causes the resin's acid catalysed reaction in the photoresist. When using the negative photoresist, a bridging reaction occurs, and patterns are formed with solubility difference of the developer (development liquid) in the exposed area and non-exposed area through the reaction.
YPP-S10K
In the mechanism of the structure of the photoresist, acid is formed from the photo acid generator that gets light from the exposure process. Also, the acid causes the resin's acid catalysed reaction in the photoresist. An antiprotection reaction occurs in the positive photoresist composition, and patterns are formed with a solubility difference of the developer (developing liquid) in the exposed area and non-exposed area through the reaction.
lar Cell
The solar cell is a device that converts solar light energy into electric energy. Depending on the type of material absorbing the light, it can be classified as being part of an Si family, a compound semiconductor family, and an organic family. Depending on the commercialization sequence, it can be classified into the 1st generation (crystal silicone), 2nd generation (silicone film, CIGS and CdTe film), 3rd generation (fuel response, organic), and next generation (quantum dot, plasmon).
YSO-700DW
This is a water soluble cutting oil developed by us [For further details, See Cutting oil (Slicing oil)].
Slicing Detergent
A detergent used to remove any pollutants that appear in the process of cutting the solar cell block into a thin film, and this can be a cause of low quality of the final product if the cutting process is not cleanly done.
SiC Dispersant
SiC is an abrasive used by dispersing it with a specific amount of cutting oil. For an even dispersion, an SiC dispersant is used as an additive.
Slicing oil / Coolant
A cooling, cutting oil used in the process of cutting the solar cell block into a thin film. There are water-soluble oils and oils that are not water-soluble. According to the environmental preservation policy, a water-soluble cooling, cutting oil has recently been used a lot.
