As the device node enters into 20nm era, the effect of non-visual defects, such as metallic and non-metallic contamination,
on the device performance is getting more and more significant and cannot be neglected anymore.
And the non-visual defect control will be crucial to yield management of under 20nm devices.
Our M-SPEC, O-SPEC and I-SPEC provides you with total solution of metallic, organic and ionic contamination monitoring for gases,
chemicals and wafers in the semiconductor ecosystem, respectively.

Founded in 2010, NvisANA has developed a device that enables real-time in-line monitoring of trace amounts of metallic contamination which is optically undetectable on the world's first and only semiconductor wafer. We will supply equipment that can detect organic matter and ions in the future.

As semiconductor process represented by yield and reliability progressed to design rule shrink of less than 20nm, the contamination that was overlooked in the previous generation devices and began to directly affect device performance production yield and device reliability.

The defect management paradigm for improving the yield has been extended to the 'non-visual' in unison with 'visual' paradigms used in the past , as a result, design rule shrinking is increasing the importance of yield management through contamination monitoring in FAB.

Based on the core competence of semiconductor wafer pollution monitoring technology, NvisANA has grown to become a total solution provider that provides contamination monitoring technology to not only semiconductor fabs but also display and materials fields. Technology development and innovation will continue.



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