PSK Inc. is engaged in manufacturing of semiconductor equipment. The company offers Dry Stripper/Asher, Plasma Oxide Cleaning, Metal Oxide Chemical Vapor Deposition, Etching equipment, Pattern profiling systems and dry cleaning equipment. PSK Inc. offers its products under "TIGMA", "Ecolite", "DAS", "PROFILER", "FUTAS", " and "ZIVIS" brand names. The company is based in Hwaseong, Gyeonggi-do Province, South Korea. PSK Inc. was incorporated in 1990.
Based in Korea, in the heart of one of the world most important semiconductor fab areas, PSK is the worldwide leading supplier of strippers with a 37% market share in 2016 (source Gartner) and over 1150 tools installed. The PSK product portfolio includes single chamber and cluster tools for wafer sizes ranging from 4” to 300mm as well as tools for photomasks.
PSK devote special focus on quality control and continuous development of new products, applications and processes. In spite of its dominant position PSK continue to strive to be creative and think out of the box. With a wealth of data converted into knowledge, PSK have been able to develop innovative technologies in the recent years.
Utilizing the accumulated data and technologies as well as the help of its talented and deeply trained personnel, PSK works very hard to convert its roadmap, focused on the development of greater innovations in technology, into reality.
DAS SERIES
Psk DAS series
DAS series is the latest generation 200mm Ashing and Etching System with increased productivity and it design with the smallest footprint for 200mm System. The system provided high quality process performance, consistency and high precision compared to previous model.
A multi-source Platform is designed for installing Microwave, FCIP or Advanced ICP, depending on the customer's application purpose. RF Bias can be used for both Ashing system (Descum) and Etching application. In addition to DAS series innovative process advancements, Major improvement in system reliability have been achieved through easier HW maintenance and field Proven customized SW. DAS series can be flexible wafer size transfer and process.
ECOLITE SERIES
Psk DAS series
Ecolite3000, successor of the Tera Series, is a simple and economic Low Temperature Ashing System designed with a Low Damage Remote Microwave Plasma Source & Bias Power.
The system achieves high ashing rates(2micro m/min) under low temperature conditions and high performance Descum processes for flip-chip bumping applications. High productivity, process recipe flexibility and small design footprints lead to Low Cost Ownership for customers.
World-class competitiveness as global leader
PSK's dry strip equipment holds the largest market share wordwide and top-tier technology.
Our equipment is selectively being developed and advanced by careful vetting of each model.
Through our research and development, we expect to become the leader of the field and maintain technological competitiveness in the market.
SUPRA Vplus
SUPRA N
SUPRA Nm
SUPRA XP
Dry cleaning
The world's best plasma oxide cleaning process
Plasma oxide cleaning(POC) is a dry cleaning process which removes unnecessary oxide films, such as natural oxides, from the Si surface before the deposition process.
POC is a scalable technology which can be extended to the oxide recess etch back process.
PSK's dry cleaning equipment plays an important roles in entering the 10nm-class DRAM semiconductors era, and PSK becomes as the world's most competitive manufaturing company replacing Japanese dry cleaning equipment.
In order to maintain our technological advantage, PSK is continuously pushing the envelope to research and develop new technologies.
INTEGER plus
INTEGER XP
New hard mask(NHM) strip
No plasma damage, higher selectivity
New hard mask(NHM) strip equipment features a selective removal of highly etching-resistant films with high selectivity technology for lower films such as oxide and nitride films.
Through our continuing research, we aim to improve facility productivity by improving strip rate.
OMNIS
Edge clean
High Throughput with better uniformity & low CoO
Edge clean removes all types of films on the edge of the wafer, whether dielectric, metallic, or organic.
Edge yield can be improved through in-process changes to the edge of the wafer and removal of contaminants in the form of particles.
With continuous R&D investment and PSK's drive to face new challenges, we make sure existing equipment performance stays upmost for the level of full customer satisfaction.
