Whether a standard wet process tool or a customer-specific solution is required: Our modular product spectrum is tailored to your requirements!
The AP&S product range includes manual, semi-automated and fully automated wet process equipment for the semiconductor-, MEMS- and micro-structuring industries as well as the R&D sector.
Our extensive wet chemical process portfolio covers etch processes, surface conditioning, resist develop, resist strip, metal lift-off, metal etch, electroless metal deposition, wafer cleaning and drying applications.
We offer you wet process equipment for batch processing and single wafer processing as well as supporting semiconductor equipment like foup and box cleaner, laboratory equipment and chemical management systems. AP&S equipment is used in front-end-of-line (FEOL) and back-end-of-line (BEOL) processes.
The AP&S wet process equipment handles masks and wafers up to 12” / 300mm, including different wafer material like silicium Si, silicium carbid SiC, gallium nitrid GaN, gallium arsenid GaAs, sapphire, glass. AP&S wet process tools are suitable for different substrate thicknesses.
