In 1975, Tong Hsing Electronics established an operation in Taipei country, Taiwan. We specialized in development and manufacture of custom semiconductor micro module assembly, and thick film and thin film substrates.
Our strategic plan is to provide high quality microelectronic packaging and substrate technology to various industries including wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, computer peripherals, medical and network equipment.
A. Ceramic Thick Film/Thin Film Substrate Fabrication.
B. Microelectronic packaging - SMT, COB, C4 flip chip, GGI flip chip, and Backend.
The latest design guidelines of Tong Hsing are in the following:
1. SMD
2. COB
3. Backend
4. CSP
5. Thick Film Metallized Substrate
6. DPC
7. Multi-layer DPC
8. Control Plan for Electro Plating Cu / Ni / Au
Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, computer peripherals, medical and network equipment.
Custom specilized Assembly Package.
Application:
RF Module, SiP, MEMS,
CMOS Image Sensor,
Automotive Hybrids,
Medical, Aerospace,
High Power Module,
VCSEL
DBC Substrate
Application:
IGBT, MOSFET, HCPV,
Automotive,
Power substrates
DPC<sup>(TM)</sup> & Thin Film Substrate
Application:
High Power LED, RF Communication,
HCPV, Automotive, Interposer
VCSEL, Crystal Package,
TE Cooler, Power Substrate
