The SIGMA1000 series are in-line sputtering system for EMI shield deposition of semiconductor package. This is a full-automation system, optimizedon mass production, and the design can be flexible to accommodate the customer’s needs.
CURUS200 series are standalone cluster system for H-VAMs™ dispensing. Dispenser’s quantity can be changed flexibly according to tact time.
H-VAMs™ is adhesive material for semiconductor package handling in sputtering system. H-VAMs™ which is easy to attach or detach semiconductor package is key element in mass production. H-VAMs™ has been developed in collaboration with Shin-Etu that can be changed according to the needs of various customer likes viscosity, thickness, shape, etc. Recently, CNI technology has developed solution for not only LGA butalso BGA package.
