Our non-contact 3D measurement systems are widely used in microelectronics and other precision industries for a vast array of applications, including flatness measurement, coplanarity measurement, roughness measurement, thickness & thickfilm measurement, measurement of transparent films and coatings, TTV measurement and much more.
Our solutions are trusted by major international companies, as well as many small and medium sized companies in R&D and production. With a worldwide network of qualified distributors and representatives, cyberTECHNOLOGIES is a strong global player our customers can count on.
cyberTECHNOLOGIES offers high-resolution, non-contact 3D measurement system options to the microelectronics and other precision industries. Our systems are widely used for a variety of applications including thickfilm measurement, flatness and warpage measurement, surface roughness measurement, coplanarity on leads and bumps as well as the measurement of transparent films and coatings. Please select the specific application below to see further details.
THICKNESS & THICKFILM
Controlling the thickness of electronic devices or measuring film thickness is essential.
SURFACE
ROUGHNESS
Non-destructive and fast surface roughness measurement according to international standards.
TOTAL THICKNESS VARIATION (TTV)
Measure absolute thickness, thickness variation (TTV), bow and warp.
FLATNESS MEASUREMENT
Flatness measurement is required for a variety of components including wafers, optical and mechanical parts.
COPLANARITY MEASUREMENT
Our optical systems even measure materials with different reflectivities (i.e. BGA and flip chip bumps).
TRANSPARENT FILMS AND COATINGS
Measurement of transparent films or deposits such as flux or epoxy.
