Originally a division of Brewer Science Inc., the Cee® business owned and staffed by former employees of Brewer Science. Their combined experience in equipment design, wafer processing, operations and technical support totals over 140 years. We are carrying on our history of product quality, performance, and reliability and expanding our focus on customization and technology development.
Cost Effective Equipment
Workstation
Cee® X-Pro II Workstation
The Cee® X-Pro II workstation features customized exhaust enclosures that integrate with stand-alone cabinets to create a virtual clean room environment—perfect for advanced prototyping and pilot-line production. The mini-environment created by the Cee® X-Pro II workstation provides the user with complete control over the environmental conditions within the workstation—including air pressure, velocity, flow, and humidity, as well as temperature stability and uniformity. These enclosures feature fan filter units (FFU) for vertical laminar flow through a particle filter of various efficiencies (E*).
Other features include:
Fully assembled and plug-in ready on delivery
ULPA, HEPA, or carbon amine filtration
Ductless or ducted exhaust
Safety-compliant chemical storage
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Spin Coat
Cost Effective Equipment (CEE) spin coaters have been the benchmark for photoresist processing since the Cee® Model 100 was introduced over 25 years ago. All of their high reliability spinners incorporate digital indirect spindle drive technology that eliminates the well-known chuck heating and motor reliability problems common in cheap spin coaters.
Cee® Apogee™ Spin Coater
Fully programmable and user-friendly, the CEE® Apogee™ Spin Coater precision spin coater features the accuracy and repeatability needed to eliminate processing variability from critical experiments. With its convenient compact footprint, wide array of chemical compatibility, and durability, this easy-to-use benchtop system will provide years of high-performance operation, making the Cee® Apogee™ Spin Coater purchase a smart and cost-effective decision. Up to 200mm round or 7" x 7" square.
Cee® Apogee™ Spin Coater
Cee® Apogee™ Spin Coater
CEE® Apogee™ 450 Spin Coater
The CEE® Apogee™ 450 Spin Coater delivers track-quality performance with revolutionary interface capabilities and the utmost in chemical compatibility in an efficient, space-saving design. This heavy-duty drive spin coater combines extremely accurate spin speed control and a high torque drive for aggressive acceleration of 300mm and larger LCD squares. Up to 450mm round or 14" x 14" square.
Bake Plate
Cost Effective Equipment (CEE) Bake Plates are the industry standard for high performance wafer bake processing. Their exclusive hot-chuck design provides the uniformity and repeatability you need to eliminate variables in your process wafer to wafer, day to day and year to year.
You need your bake process to manage three key factors:
Accurate and uniform thermal characteristics. All Cee® Bake Plates are constructed with proprietary materials and processes to ensure the highest thermal performance and product lifetimes measured in decades.
Repeatability. No process is useful if it’s not repeatable. Variables such as room temperature, stray air currents and even operator skill are minimised with the Apogee™ Bake Plate three-layer lid design combined with electronic Smart Pins™ that automate the start and stop points of the bake cycle.
Flexibility. All Apogee Bake Plates run on DataStream™ technology. Unlimited recipes, and logging of all critical process parameters including room temperature and humidity, four bake modes, remote network access, and real-time monitoring are the tools you need to control your process.
There is a reason that top semiconductor manufacturers and semiconductor equipment makers around the world specify CEE Bake plates for their own laboratories and that reason is performance.
CEE® Apogee™ Bake Plate
The Apogee™ precision Bake Plate features a revolutionary intuitive interface, a space-saving design, and track-quality thermal accuracy and uniformity. Fully programmable and user-friendly, the Apogee™ precision Bake Plate features the accuracy and repeatability needed to eliminate processing variability from critical experiments. Recipes are easily entered, monitored, and stored with the convenient full-colour touch screen interface with DataStream™ Technology. Compact footprint, intuitive design, and unequalled experience add up to years of high-performance bake step processing, perfect for any low-volume or R&D laboratory processing environment.
Cee® Apogee™ Bake Plate
Cee® Apogee™ Bake Plate
CEE® Apogee™ 300 Bake Plate
The Apogee™ 300 Bake Plate is designed for process and R&D engineers requiring a bake plate for large-area substrate applications and is capable of handling a maximum size of 300mm round or 12” x 12" square substrates.
Spin Developer/Clean
CEE® Spin Developers can be configured for fan style top-spray or side-spray, and puddle dispense using multiple materials such as pre-wets, developer, rinse agents, solvents and nitrogen blow-off to enhance drying. These tools are routinely used for the exacting needs of leading-edge photolithography, e-beam lithography, thick film MEMS and bio-medical processing, as well as photomasks and other exotic substrates.
CEE® Apogee™ Spin Developer
The Apogee™ Spray/Puddle Spin Developer provides the highest in precision and quality while maintaining access to in-depth process data and recipe creation methods. Up to 200mm round or 7" x 7" square.
Cee® Apogee™ Mechanical Debonder
Cee® Apogee™ Mechanical Debonder
CEE® Apogee™ 450 Spin Developer
The Apogee™ 450 Spin Developer delivers track-quality performance with revolutionary interface capabilities and the utmost in chemical compatibility in an efficient, space-saving design. The heavy-duty-drive spin developer combines extremely accurate spin speed control and a high torque drive for aggressive acceleration of 300mm and larger wafers and LCD squares up to 14” × 14”. Fully programmable and user-friendly, the Apogee™ 450 Developer features the accuracy and repeatability needed to eliminate processing variability from critical experiments. Up to 450mm round or 14" x 14" square.
Temporary Bond & Debond
Cee® Temporary Bonders and Debonders are used around the world for small volume production in the fab and critical process development in the lab. These tools are designed and built with wafer and device yield in mind. Rapidly implement a temporary bonding and debonding process with expert knowledge in an integrated solution.
CEE® Apogee™ Temporary Bonder
Cee® Temporary Bonders and Debonders are used around the world for small volume production in the fab and critical process development in the lab. These tools are designed and built with wafer and device yield in mind. Rapidly implement a temporary bonding and debonding process with expert knowledge in an integrated solution.
Cee® 1300CSX Slide Debonder
Cee® 1300CSX Slide Debonder
CEE® 1300CSX Thermal Slide Debonder
The Cee® 1300CSX Thermal Slide Debonder is a production fab ready, semi-automated tool. It uses dual heated platens to soften adhesives or waxes in a bonded wafer pair to their melting point and then applies precisely controlled forces to slide the carrier and device wafers apart. Temperatures, positions, forces and speeds are recipe controlled with full logging of each wafer process.
These tools are primarily used for small volume compound semiconductor and thinned silicon production fabs where precise control is required to maintain yields and device performance. Because the 1300CSX does not use robots to load and unload wafers, footprint and cost is dramatically reduced, and flexibility to work with multiple wafer sizes is enhanced.
CEE® Apogee™ Mechanical Debonder
The Apogee™ Mechanical Debonder is the newest generation Debonder for small volume production, and research and development applications. Coupled with appropriate bonding adhesive materials, the process works by holding the device wafer on a film frame against a flat surface and gently peeling the carrier away with precisely controlled forces.
Advantages include minimised stresses on the device wafer, high throughput, and room temperature operation allowing the use of very high temperature adhesives for post bond processing. Unlike solvent debond processes, there are no messy solvents and the device wafer remains attached to the film frame throughout the process, so no more lost devices.
The debond process is fully programmable and automated leaving operator interaction limited to simply loading bonded pairs and unloading the de-bonded device and carrier wafers. As with other CEE® tools, the Apogee Mechanical Debonder provides the performance of a track-system without the hassle, footprint, and cost. DataStream™ technology provides real-time network access, remote monitoring and logging of all critical parameters.
