High-throughput, Selective Laser Annealing System for Monolithic Magnetic Sensor Applications
High-throughput Laser Annealing System for Power Device Applications
TLS-Dicing™ System for Separation of Silicon and Silicon Carbide Wafers

DMP - Generation of 3D Printed Micro Metal Parts by Micro Laser Sintering
The DMP solutions for Micro Laser Sintering deliver best results in terms of detail resolution, accuracy and surface finish for 3D printed micro metal parts.

microPREP™ PRO - High-Throughput Laser-Based Microdiagnostics Sample Preparation
The all-new microPREP™ is the first instrument to enable fast, clean, and efficient laser ablation for sample preparation in TEM, X-SEM, XRM, APT, and micromechanical testing.

microCELL™ – Systems for Laser Contact Opening (LCO) and Half-Cell Cutting in Photovoltaics
The microCELL™ solutions are a highly productive laser systems for Laser Contact Opening (LCO) of high efficient PERC solar cells as well as laser dicing of full cells into half cells with Thermal Laser Separation (TLS-Dicing™),

microSHAPE™ - Laser Systems for Cutting of Glass and Sapphire
The microSHAPE™ laser systems are modular platforms designed for high accuracy cutting, drilling and structuring of glass and sapphire substrates.

microDICE™ – Wafer Dicing System for Separation of Silicon and Silicon Carbide Wafers
The microDICE™ laser micromachining system leverages TLS-Dicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si) and silicon carbide (SiC), into dies with outstanding edge quality while increasing manufacturing yield and throughput.

microMARK™ - System Solutions for Marking of Ophthalmic Lenses
The microMARK™ laser systems are suitable for laser engraving of all types of ophthalmic lenses, e.g. prescription and sunglasses, or contact lenses. All systems use UV lasers for permanent marking.

Customized/OEM Laser Systems for Micromachining Applications
We focus on laser micromachining of virtually any material using short-pulse and ultra-short pulse lasers as well as short wave lasers (UV). Because of our many years of experience in laser technology our machines achieve the best processing results in the µm and sub-µm range.



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