EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.
With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in the U.S. and Japan, EVG is focused on delivering superior process expertise to its global R&D and production customer and partner base – from the initial development through to the final integration at the customer’s site.
Founded in 1980, EVG services and supports an elaborate network of global customers and partners all over the world, with more than 1000 employees worldwide and fully-owned subsidiaries in the U.S., Japan, South Korea, China and Taiwan.
Our products, which include lithography, bonding, nanoimprint and metrology systems, play an essential role in enabling today’s leading device makers to develop and manufacture tomorrow’s technology innovations.
EVG holds the dominant market share for all types of wafer bonding equipment and is a technology leader in lithography for advanced packaging and nanotechnology. Our metrology systems are optimized to ensure the tightest process control and highest yields for our industry-leading process equipment.
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IQ Aligner NT
Lithography
EVG’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners, its newly developed maskless exposure lithography systems and the in-house process knowledge of its resist processing systems.
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HERCULES NIL
Nanoimprint Lithography
EVG is the market-leading supplier of nanoimprint lithography (NIL) equipment and integration processes. EVG pioneered and mastered NIL from a research approach more than 15 years ago, to implementation in volume production on various substrate sizes from 2-inch compound semiconductor wafers to 300 mm wafers and even on large-area panels.
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BONDSCALE
Bonding
With our long-term experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding.
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EVG40NT
Metrology
EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
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Process Development Services
Process know-how is key to achieving the shortest time to market for your product. EVG provides support for initial development through final integration at the customer’s site.
