From micrometer to cutting-edge nanometer features, TOK provides optimal photoresists and related equipment tailored to the production of various semiconductor devices
Photoresists
Rubber type Negative photoresist
OMR series
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Photoresist for g-line
OFPR series
TSMR series
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Photoresist for i-line
TSCR series
THMR-iP series
TDMR-AR series
TSMR-iN series
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Photoresist for KrF
TDUR-P series
TDUR-N series
TGMR-DP series
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Photoresist for ArF
TARF-P series
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Photoresist for ArF Immersion
TARF-PI series
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Photoresist for EUV
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Electron beam photoresist
OEBR series
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Photolithography Relative Chemicals
Interlayer Insulating Film
OCD series
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Spin-On diffusion source
PBF series
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Materials for Cover Coat
OFR series
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Materials for Directed Self Assembly
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Other materials
TPF (High-purity aqueous resin solution)
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Developing solution, Stripping solution, and Thinner
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From micrometer to cutting-edge nanometer features, TOK provides optimal photoresists and related equipment tailored to the production of various semiconductor devices
Coating machines
CS series
Coating machines CS series
Spin coaters with high functionality achieving cost effectiveness.
Applicable to 100 / 125 / 150 / 200 / 300 mm Wafers
Learn more and Contact us
SOD / Photoresist Spin Coater TR6133UD
Applicable to 75 / 100 / 125 / 150 / 200 mm Wafers
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Developing machines
CSH series
Developing machines CSH series
Automatic developing machines for single wafer processing with excellent production efficiency.
Applicable to 150 / 200 / 300 mm Wafers
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Vacuum UV hardning machines
TVC-8000 series
Vacuum UV hardning machines TVC-8000 series
Vacuum UV hardening machines with better heat resistance, etching property and plating resistance.
Applicable to 100 / 125 / 150 / 200 mm Wafers
Chemical supply system
Automatic Developer Diluting and Supplying Machine TAS-1000 series
Chemical supply system that automatically conduct dilution and concentration controlling, focusing on the cost advantage of using a large volume of developing solution.
Offering TOK’s unique packaging / MEMS manufacturing technologies, in terms of both materials and equipment, that widely support the manufacturing of lighter, thinner and more compact mobile devices and electronic components with high functionality
Materials for Semiconductor Packaging process
Photoresists for Cu, Ni, Sn-Ag, and Pd Electrolytic Plating of Au Bumps, Cu Pillars, Microbumps and Other Structures
We provide a full lineup of various high-sensitivity, high-resolution, positive thick-film photoresists for electrolytic plating that are resistant to gold (Au), silver (Ag), tin (Sn), copper (Cu), nickel (Ni) and palladium (Pd) metal plating solutions. These photoresists are used to form microbumps, gold stud bumps, and copper posts on 3D through-silicon-via (TSV), wafer-level chip-scale package (WL-CSP), Cu pillar/flip chip packages, LCD drivers and other applications. Our photoresists possess a high process margin in plating processes, enabling the formation of high-resolution, well-shaped via hole patterns with superior adhesion to Cu-substrates. Moreover, in photoresist film stripping after the plating process, our photoresists are easier to strip than negative photoresists. TOK’s positive type photoresist enables total cost reductions in the bump electrode formation process. Photoresist thicknesses of 10 to 100 μm are supported. We also offer a type of ultra-thick-film photoresist that can be applied to the formation of tall Cu pillar electrodes for the Through Mold Via (TMV) & Package on Package (PoP) component.
PMER P-CS series, PMER P-LA series, PMER P-HA series, PMER P-CY series
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Photoresists for RDL Plating
We provide a full range of photoresists for plating to address redistribution layer (RDL) formation. These photoresists support the latest semiconductor packaging technologies, namely wafer level chip-scale package (WL-CSP), wafer/panel level-fan out package, along with providing the high resolution needed to form ultra-fine RDLs for interposers, and supporting thicknesses ranging from 5-20 μm thin films that have a wide depth of focus (DOF) margin, to thick films.
We provide both naphthoquinone and chemically-amplified types of photoresist, which feature superior tolerance for the integration environment. In addition, we offer high-resolution types of photoresist that can be used in conjunction with an Na2CO3 inorganic alkali developing solution.
PMER P-WG series, PMER P-CY series, TMMR P-W1000T PM
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Photoresists for TAB/COF, FPC Etching Processes (Roll-to-Roll)
These photoresists have the coating performance and flexibility needed to support roll-to-roll processes for flexible substrates employing polyimide film in tape-automated bonding (TAB), chip on film (COF), and flexible printed circuit boards (FPC). We also provide high-resolution, high- adhesion positive photoresists that cater to the semi-additive method associated with fine wiring patterns, in addition to supporting Cu etching (subtractive method).
PMER P-RC series, PMER P-RL series
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Photoresists for Deep Si Etching
ZR8800 : A thick-film positive i-line photoresist with high heat resistance that is capable of stable etching inside the wafer surface through deep Si etching for 2.5D and 3D packaging using TSV. This photoresist is able to form highly vertical stacked patterns even under thick-film conditions. With high heat resistance, the ZR8800 photoresist is also able to withstand harsh dry etching conditions while maintain its photoresist patterning with very little change in the profile form factor during the etching process.
PMER P-CY series : A photoresist series for deep Si etching employing the non-Bosch etching process deep-reactive-ion-etching (DRIE) with superior crack resistance in the forced cooling process of the substrate.
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Photoresist for Lift-off Processes
TLOR series: We provide both positive and negative photoresists that are able to form lift-off structures using single layers and single exposures. These photoresists support sputter metal deposition processes. Notably, the positive photoresists in this series can be easily stripped after processing using ordinary organic solvents.
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Anti-corrosive Photoresist Stripping Solutions
ST-120/ST-121 : These stripping solutions are designed to remove dry film photoresists as well as both negative and positive thick-film photoresists that have been used in the plating process. Thanks to their superior anti-corrosive properties, these stripping solutions enable photoresist layers to be stripped and removed without any damage to Cu, Al, and other metals. In addition, if applied before curing, the stripping solutions are able to remove polyimide. The solutions can be used for wafer rework in the polyimide process without damaging the Al layer.
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Photoresists for Manufacturing MEMS and Image Sensors
Photosensitive Permanent Film Photoresists
Film Photoresist TMMF-S2000/Liquid Photoresist TMMR-S2000
These photoresists provide a low-temperature curing, negative photosensitive permanent film with high resolution and high adhesion, enabling the formation of high aspect ratio patterns. They can be applied to the formation of cavity structures through the tenting process using film photoresists, in addition to forming insulation layers for semiconductor integration and channels for Micro Electro Mechanical Systems (MEMS) devices. Compared with conventional the sacrificial layer process, these photoresists enable significant process simplification. We also offer a full range of products that can be used as photosensitive adhesives for Si-to-Si, Si-to-glass and glass-to-glass bonding.
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Photosensitive Transparent Permanent Film Photoresists (Microlenses / Transparent Insulation Films)
TMR series : This series ensures a high transmittance of more than 95% in the visible light spectrum above 400 nm. The TMR series provides special purpose photoresists for highly reliable coat forming that can be applied to CMOS image sensor (CIS) microlenses, transparent insulation layers and other uses. These photoresists enable convex lens shapes to be formed using the heat flow in the bake process after patterning in the photolithography process.
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Cover Coats Soluble in Water, Organic Solvents and Special Solvents
Cover Coat
We offer a full range of coating materials designed to protect surfaces from contaminant and particle adhesion, as well as contact and friction, in addition to shielding surfaces from chemical damage.
Offering TOK’s unique packaging / MEMS manufacturing technologies, in terms of both materials and equipment, that widely support the manufacturing of lighter, thinner and more compact mobile devices and electronic components with high functionality
Coating machines
CS series
Coating machines CS series
Spin coaters with high functionality achieving cost effectiveness.
Applicable to 100 / 125 / 150 / 200 / 300 mm Wafers
Learn more and Contact us
Developing machines
CSH series
Developing machines CSH series
Automatic developing machines for single wafer processing with excellent production efficiency.
Applicable to 150 / 200 / 300 mm Wafers
Learn more and Contact us
Vacuum UV hardning machines
TVC-8000 series
Vacuum UV hardning machines TVC-8000 series
Vacuum UV hardening machines with better heat resistance, etching property and plating resistance.
Applicable to 100 / 125 / 150 / 200 mm Wafers
Presenting a new direction for the physical limits of miniaturization and proposing a new semiconductor manufacutring technology, i.e., multi-layer stacking, that promises better production efficiency
Zero Newton Materials
Adhesive materials
TZNR A series
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Thinners to remove adhesive materials
TZNR thinner
Presenting a new direction for the physical limits of miniaturization and proposing a new semiconductor manufacutring technology, i.e., multi-layer stacking, that promises better production efficiency
Zero Newton bonding machines
TWM series
Zero Newton bonding machines TWM series
Integrated processing machines for bonding a carrier plate to a silicon wafer with high precision.
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Zero Newton debonding machines
TWR series
Zero Newton debonding machines TWR series
Integrated processing machines for debonding a silicon wafer from a carrier plate with low stress.
Realizing both LCD’s high resolution and economic efficiency by synergy effects from the combination of sophisticated materials technology developed over the years and coating technology with excellent uniformity
For LCD
Photoresists
TFR series (High-sensitivity positive type for TFT)
TFR-DI series (High-sensitivity i-line positive type for TFT)
CFPR BK series (Black resist for color filter BM forming)
PMER P7100 series (High-sensitivity positive type for STN)
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Other materials
TPAR series (High-reliability transparent materials)
MOF INK (Overcoat for transparent electrodes)
Thinner, Stripping solution, OAP, CFPR rinse
TPSR series (Materials for Photo Spacer)
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For Organic EL
Photoresists
TELR-N series (Negative type for cathode separators)
TELR-P series (Positive type for insulating layers)
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For Touch Panel
Photoresists
WTP BK series（Black resist for touch panel）
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Other materials
Insulator products
Overcoat products
Realizing both LCD’s high resolution and economic efficiency by synergy effects from the combination of sophisticated materials technology developed over the years and coating technology with excellent uniformity
Coating machines
Non-spin coaters (Spinless)
Non-spin coaters (Spinless)
Non-spin coaters with optimal material properties and coating performance, saving the use of solution, energy and space.
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UV curing machines
TIPS series
UV curing machines with improved heat resistance and dry etch resistance while maintaining detachability.
your technology needs, TOK offers high value-added materials which cultivated by our technology and know-how.
Structure Materials
Photo patternable permanent materials for structure fabrication（TMMF ®/ TMMR®）
tmmr
Negative tone photo patterable permanent film with high resolution and high adhesion, enabling the formation of high aspect ratio patterns for MEMS (Dry film and liqud type)
Photo Patternable Adhesives Materials
Photo Patternable Adhesives Materials
Pattern & Adhesive in One Material
UV Nanoimprint Materials
UV Nanoimprint Materials
UV imprintable materials which shows high RI, low RI, and solvent-free high RI materials having excellent reliability and good transparency.
Surface Modification Materials
Hydrophilic Coating Materials
Hydrophilic Coating Materials
Hydrophilicity can be applied to high contact angle substrates without pretreatment
Photo Patternable Hydrophobic / Oleophobic Materials
Photo Patternable Hydrophobic / Oleophobic Materials
The material provides hydrophobic / Oleophobic fine patterns by photolithography
Hydrophilic Coating Materials (Chemical Bonding Type)
The material can be formed a hydrophilic nano level thin film only by coating on glass or oxide film
Microprocessing Film
Porous Polyimide Film
Porous Polyimide Film
Unique and Uniformed pore structure
mmWave Absorber
Thin Film mmWave Absorber
Thin Film mmWave Absorber
High Performance
with less than 250 μm thick film
High Heat Resistance and High Transparency Polyimide Film
Varnish for high heat resistance and high transparency polyimide film
Varnish for high heat resistance and high transparency polyimide film
Varnish for high heat resistance and high transparency polyimide film. Provided in the form of polyamic acid.
From micrometer to cutting-edge nanometer features, TOK provides optimal photoresists and related equipment tailored to the production of various semiconductor devices
Photoresists
Rubber type Negative photoresist
OMR series
Contact us
Photoresist for g-line
OFPR series
TSMR series
Contact us
Photoresist for i-line
TSCR series
THMR-iP series
TDMR-AR series
TSMR-iN series
Contact us
Photoresist for KrF
TDUR-P series
TDUR-N series
TGMR-DP series
Contact us
Photoresist for ArF
TARF-P series
Contact us
Photoresist for ArF Immersion
TARF-PI series
Contact us
Photoresist for EUV
Contact us
Electron beam photoresist
OEBR series
Contact us
Photolithography Relative Chemicals
Interlayer Insulating Film
OCD series
Contact us
Spin-On diffusion source
PBF series
Contact us
Materials for Cover Coat
OFR series
Contact us
Materials for Directed Self Assembly
Contact us
Other materials
TPF (High-purity aqueous resin solution)
Contact us
Developing solution, Stripping solution, and Thinner
Coating machines
CS series
Coating machines CS series
Spin coaters with high functionality achieving cost effectiveness.
Applicable to 100 / 125 / 150 / 200 / 300 mm Wafers
Learn more and Contact us
SOD / Photoresist Spin Coater TR6133UD
Applicable to 75 / 100 / 125 / 150 / 200 mm Wafers
Learn more and Contact us
Developing machines
CSH series
Developing machines CSH series
Automatic developing machines for single wafer processing with excellent production efficiency.
Applicable to 150 / 200 / 300 mm Wafers
Learn more and Contact us
Vacuum UV hardning machines
TVC-8000 series
Vacuum UV hardning machines TVC-8000 series
Vacuum UV hardening machines with better heat resistance, etching property and plating resistance.
Applicable to 100 / 125 / 150 / 200 mm Wafers
Learn more and Contact us
Chemical supply system
Automatic Developer Diluting and Supplying Machine TAS-1000 series
Chemical supply system that automatically conduct dilution and concentration controlling, focusing on the cost advantage of using a large volume of developing solution.
