Aurigin Technology is in the business of design, development and manufacture of automation machines and manufacturing solutions for Advanced Semiconductor Packaging and Smart Labels / RFIDs as well as for new developmental products such as Optoelectronics, MEMS, Photonics industries etc.
SMART Automation
... a series of equipments specially developed to support Reel-to-Reel RFID High Speed Flip Chip Process Automation.
... ACF Attach
... ACP or NCP Dispense
... Flip Chip Place/PreBond
... Final Bond
... Test
... Process Technology Package
Antenna web configurations in single or multiple rows are possible. Various die interconnect technologies are supported.
Numerous die feed methods are available ... specialised die-feeders, waffle-pack-trays, wafers etc.
..... modular work-cells
..... flexibility
..... vision guided placement
..... high speed on-the-fly vision processing
Fully Automatic BGA/CSP
Solder Ball Mount System
Aurigin au800
Fully Automatic BGA/CSP
Solder Ball Mount System
Aurigin au800plus
Fully Automatic FCBGA
Solder Ball Mount System
Aurigin au901c
Fully Automatic
Boat-to-Tray Sorter
Offloader System
Aurigin bt215/bt218
Fully Automatic CSP/BGA
Solder Ball Repair System
Aurigin R3i
SMT/AOI-BM
Transfer Buffer System
Aurigin Link-i8
