Clean Systems
Choose from three series of YES Clean Systems for gentle surface cleaning, decontamination, and surface activation. YES Clean Systems can also descum and strip off photoresist using downstream plasma. Unique benefits of YES Clean Systems include:
Reduction in equipment footprint by half over competition
Lower cost of ownership by almost 50%
Proven high reliability from system designs with as few as three moving parts
Applications
Plasma Cleaning
Photoresist removal/descum
Polyimide, organics and CuO removal
Surface activation
Adhesion promotion
Plasma surface decontamination
RFS Series
RFS Series
Eco Clean Series
EcoClean
G series
G Series
RFS Series
User-friendly plasma cleaning systems provide higher yields and repeatable results.
Removes thick layers of photoresist or polyimide quickly (up to 6,000-7,000 Å/min)
Applications range from aggressive strip processes to gentle descum and surface modification
Downstream process balances plasma charge and protects against damaging UV exposure
Precise temperature control for uniform, repeatable results Up to four (4) process gas connections
Up to four (4) process gas connections
CONTACT SALES
DATASHEET
LEARN MORE
RFS Series
Coat Systems
Modify surfaces at the nanoscale with YES Coat Systems, which apply monolayer coatings to induce hydrophobic (water-repelling) or hydrophilic (water-attracting) properties. With YES Coat Systems, coat a variety of substrates with unique benefits including:
Choose among 100+ chemical precursors
Achieve up to 3X improvement in temperature uniformity over our competition
Leverage YES expertise and proven history in deploying thousands of systems across various emerging industries
Applications
Surface modification
(adhesion / hydrophobic / hydrophilic)
Adhesion improvement
Anti-stiction layer
Surface priming for microarrays
DNA sequencing and microfluidics
Self-assembled monolayer deposition
and removal
Seed layer for metallization
EcoCoat
EcoCoat
UltraCoat
UltraCoat™
TA Series
TA Series
EcoCoat
Flexible Silane Monolayer Deposition/Prime System with Plasma
Excellent control of process parameters yielding very stable processes with minimal chemical usage
Scalable to volume production
>100 chemical processes developed from organosilanes, PEG and biotin functional compounds
40KHz or 13.56MHz plasma pre-cure
CONTACT SALES
DATASHEET
LEARN MORE
EcoCoat
image coming soon
Cure Systems
Transform materials using thermal and chemical processes via YES Cure Systems for emerging technology and emerging research needs. For instance, semiconductor manufacturers have used YES Cure Systems to cure polyimide precursors for advanced packaging. With YES Cure Systems:
Achieve up to 50% improvement in cure time
Cut total cost of ownership (TCO) in half
Improve the performance of products with less outgassing, greater film stability, and higher reliability
Applications
Polyimide, BCB or PBO cure
Wafer-to-wafer bonding anneal
Vacuum anneal up to 400°C
Pre-metal or pre-PVD bake and degas
PB Series
PB Series
Verta Cure XP
VertaCure XP
Verta Cure PLP
VertaCure PLP
PB Series
Manual Load High-Temperature Vacuum Cure Systems
Faster process: 3.5 hours vs 8+ hours
Laminar flow reduces/eliminates particles
More complete cure (5x less outgassing)
Less film stress and low wafer warpage
1.6x to 2x less power and N2 consumption
Much lower capital cost, 2-3x lower CoO
CONTACT SALES
DATASHEET
LEARN MORE
PB Series
Bond
Perform low-temp direct bonding and high-temp vacuum annealing with a single production-proven system. Ensure consistent high reliability for demanding 3D stacking and heterogeneous integration applications in high bandwidth memory and other critical areas.
Repeatable, controllable results in high volume manufacturing
Complete bonding with excellent reliability
Excellent particle performance
Applications
3D packaging
CMOS image sensors under panel
Polyimide bake
Copper anneal
Wafer-to-wafer bonding annea
DtP and PtP bonding
vertabond
VertaBond
VertaBond
Ensure complete, reliable and void-free wafer and panel bonding in less time with a reduced thermal budget. Achieve superior bond strength and particle performance with excellent temperature uniformity. Key benefits include:
Void-free hybrid bonding in less time and at lower temperatures
Vacuum anneal provides Cu-Cu bonding without voids, delamination or dishing
Laminar flow reduces/eliminates particles
Bonding strength increases 3-4.5x under vacuum at temperatures as low as 200°C or 300°C compared to atmospheric anneal
Vacuum anneal enables 6 μm pitch with no voids or bubbles
Less film stress and low wafer warpage
