centrotherm photovoltaics AG is the world's leading technology and equipment provider for the photovoltaics sector. With more than 30 years of experience and an extensive, proven technology platform on almost all levels of the photovoltaic value chain, the company sees itself as a pioneer in the industry.
Photovoltaic manufacturing equipment
Our core business is the development and sales of turnkey production lines for the manufacture of crystalline solar cells, including the full range of engineering and technological process services. We supply our customers with diffusion furnaces, PECVD systems and drying and annealing furnaces as key equipment.
We also use components produced by partner companies according to our specifications. We integrate these into coordinated production lines, which cover all process steps required for the manufacture of crystalline solar cells. We are now supplementing our service portfolio with module lines for crystalline module production.


Tube furnace for low-pressure diffusion processes
Processes
POCl3 Diffusion
BBr3 Diffusion

Batch-type PECVD system for passivation and nitride coating
Processes
SiNx PECVD
SiOx PECVD
SiONx PECVD
AlOx PECVD
Multi-Layer

Batch-type system for R&D c-Si solar cell applications
Processes
Atmospheric
Diffusion | Oxidation | Sintering | Annealing
Low Pressure
Oxide | Nitride | Oxinitride
LPCVD
Polysilicon | Siliziumnitride | Oxide | Oxinitride

Integrated Solar Cell Production
From planning to start-up to finished solar cell
centrotherm offers production lines that have been tailored to your requirements for the production of mono and multi-crystalline solar cells. The scope of these services comprises the centrotherm core processes as well as the OEM process systems specified by us and the respective automation solutions. Thanks to the perfect detailed coordination of the overall process, we are in a position to guarantee the key performance parameters, such as solar cell efficiency, production throughput and yield - in connection with low production costs.


Our support covers the installation, start-up and ramp-up of production lines as well as additional services, such as project management, after sales service and consulting in addition to technology transfer. After your system has been installed, we continue to optimize existing lines through upgrades and after sales service solutions.

Especially with regard to newcomers to cell manufacturing that do not possess their own in-house know-how, we are well positioned to provide assistance. We facilitate market launches through our Full Production Solutions by enabling new market entrants to offer high performance solar cells based on an optimum mass production based cost structure from the start.
Planning and engineering of the production line including selection of the optimum technology and fab design
Feasibility studies and business plans for installation and operation
Facility consulting, in particular with regard to chemical supplies, ultrapure water and other media (facility engineering)
Project planning and management
Installation, start-up and ramp-up of production equipment and automation
Technology support and transfer
Training and process seminars for customer staff
Procurement of spare parts required for the ongoing operation of the production line
Service and maintenance concepts

Semiconductor
As one of the leading developers and manufacturers of production equipment for the semiconductor industry, we offer a broad spectrum of processes for various technologies and applications, such as logic and memory devices (e.g. Flash, DRAM), power semiconductors (e.g. Si, SiC), LED, SMT, MEMS or sensor technology.

Annealing (e.g. implant annealing, diffusion),
Formation (e.g. LPCVD, plasma oxidation, RTO)
Modification (e.g. oxide nitridation and silicide formation) of layers

Our team of highly qualified process engineers devises innovative solutions for the ever more exacting demands of the industry, which mandate the availability of electronic components that are becoming increasingly miniaturized, while offering more functions and higher speed than the previous generation. Therefore the following equipment is applied:

Horizontal and vertical batch systems (atmospheric or vacuum processes)
Single wafer systems (RTP, low-temperature microwave oxidation)
Vertical high temperature furnaces (annealing up to 2000 °C and oxidation up to 1350 °C)

These systems offer manufacturers a maximum of flexibility for their specific requirements. We do not accept any compromises in the continuous further and new development of our solutions when it comes to process quality, safety and production efficiency. We guarantee you, our customers, our superior centrotherm quality standards at all times. In order to enable these aspirations and commitments, we have R&D and demo equipment at our disposal at the headquarters in Blaubeuren. We develop and test processes under conditions that simulate those of actual production scenarios at all these facilities. We not only maintain cooperative arrangements with renowned industry and research partners, but we also work closely in joint research projects with our customers, whom we provide with engineering, service and consulting support.

High-temperature furnace for SiC and GaN annealing and Graphene growth
Processes
Annealing of SiC and GaN wafers
Graphene growth

High-temperature oxidation furnace
Process
Oxidation

Vertical wafer process system for mass production
Processes
Annealing
Diffusion
LPCVD

Vertical wafer process system for mini-batch applications
Processes
Atmospheric Processes
Annealing
Oxidation
Diffusion
LPCVD
PECVD

Wafer process system for multifold applications
Processes
Annealing
Oxidation
Diffusion
LPCVD
PECVD

Horizontal high-throughput system for 300 mm wafers
Processes
Annealing
Oxidation (wet/dry)

Low temperature microwave plasma oxidation
Processes
Plasma oxidation
Nitridation
In-situ Annealing

RTP equipment for compound semiconductor and silicon
Processes
Ion implant annealing
Silicide formation (Ti, Co, Ni, Pt, etc.)
Oxidation
PSG reflow
Metallization annealing
Further applications

Service & Consulting
We provide engineering and process-technology services for our customers in the semiconductor industry. We continue to support our clients with service offerings and consulting services after commissioning and enable the further improvement of existing production systems through upgrades.

Our services at a glance

Delivery, assembly and commissioning of production systems on-site
 Training of customer staff in the operation of production systems
Purchasing of replacement parts required for the continuous operation of production systems
 Supplementary service offerings and consulting for systems in ongoing production processes (e.g. remote systems)
Remote control and maintenance ensures fast analysis and troubleshooting of system errors
Optimization of processes and production stages
Maintenance services
Retrofittings, refurbishments and upgrades of equipment
 
Microelectronics
As longtime developer and manufacturer of production equipment for the microelectronics industry, we offer a broad spectrum of thermally activated processes for a wide range of technologies and applications, such as thick film processes or DCB , LTCC, and MLCC manufacturing:

Soldering of power semiconductors, optoelectronics and high temperature components (atmospheric and high pressure)
Drying and sintering for thick film technologies (DS)
Firing processes for Low Temperature Cofired Ceramics (LTCC)
Firing processes for Multi Layer Chip Capacity (MLCC)
Remelting and connection processes for Direct Copper Bonding (DCB)

Our team of highly qualified process engineers devises innovative solutions for the ever more exacting demands of the industry, which mandate the availability of electronic components that are becoming increasingly miniaturized, while offering more functions and higher speed than the previous generation:

Oxidizing, reductive and passive process conditions
Optimal thermal transition and efficient cooling technology
Exact and repeatable temperature control thanks to digital state-of-the-art measuring and control functions
Particle-free and low-mass transport apparatus for highly sensitive components
Temperature ranges from 20 – 2000°C (according to application)

Furthermore, we put emphasis on total costs of the manufacturing process:

Long lifetime, high redundancy and low maintenace efforts
Cleanroom-friendly and heat neutral equipment design
Designed for cleanroom facilities without heat radiation
Low consumption of energy and cooling water thanks to optimal isolation of process chamber
Low consumpton of protective gas thanks to optimal load lock technology

We do not accept any compromises when it comes to safety for operator, equipment or production. Thus, a reliable safety concept ensures an optimal individual production process:

Access and permission system for equipment control
Redundant protection against excess temperature and flammable gases
Complete documentation of process parameters
High-quality housing offers contact protection from electric components and hot surfaces

Automated vacuum soldering furnace for high-volume production
Processes
- Advanced Packaging
- Power Semiconductor
- Hybrid Microelectronic Assemblies
- Optoelectronics Packaging
- Package Sealing
- Annealing
- Oxidation

Vacuum Soldering Systems for high volume production
Processes
- Advanced Packaging
- Power Semiconductors
- Sealing
- Soldering

Conveyor furnace for Direct Copper Bonding (DCB)
Processes
- Direct Copper Bonding

Conveyor furnace for serial production and R&D
Processes
- Thick film
- MLCC
- LTCC

Full Hydrogen Atmosphere Conveyor Belt Furnace for Glas-to-Metal Seals and Packaging Applications
Processes
- Glass-to-Metal Seals
- Soldering
- Reflow Soldering
- Microelectronics Packaging


 

Files

Recommended Companies