ASMPT, founded in 1975, is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process - from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Our Semiconductor Solutions Segment Business offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, photonics, and optoelectronics industries. Our SMT Solutions develops and sells best-in-class DEK printers for the SMT, semiconductor and solar markets as well as best-in-class SIPLACE SMT placement solutions.

ASMPT is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989



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 All  Wire Bonding Equipment  Test & Finish Handling System  Deposition Process Equipment  Dispensing Equipment Surface Mount Technology  Wafer Separation  Encapsulation Equipment  Sintering Equipment  AOI/FOL Equipment  Singulation, Trim & Form System  CIS Equipment  Die Attach Equipment  LED Testing, Sorting & Taping System  Factory Automation


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