DuPont Electronics & Imaging is a global supplier of materials and technologies serving the semiconductor, advanced chip packaging, circuit board, electronic and industrial finishing, display, and digital and flexographic printing industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies.
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CMP Pads
Broad portfolio of CMP pads to meet the needs of any application.
CMP Slurries
A range of offerings for chemical mechanical planarization (CMP) including Novaplane™, Optiplane™, Acuplane™ and Klebosol® slurries.
Photoresists
DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.
Anti-Reflectants & Functional Sublayers
Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.
Advanced Overcoats
Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.
Ancillary Lithography Materials
DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.
Electronic Grade Polymers | DuPont Electronic Solutions
DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.
Metrology & Imaging Services
We offer services such as defect testing or patterning wafers
EKC® Strippers & Rinses
Strippers to remove photoresist used during the lithography process
Post-CMP Cleaners
Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.
Post-Clean Treatments
Post-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.
Post-Etch Residue Removers
Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.
Removers for LED Fabrication
Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.
WLP Photoresist Removers & TSV Cleaners
Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing.
Bump Plating Photoresists
DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.
Copper Pillar Plating
Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.
Copper Redistribution Layer
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.
Packaging Dielectrics
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.
Solder Bump Plating
DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.
Through Silicon Via Copper
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.
Under Bump Metallization
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
Die Attach Adhesives
Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, high moisture, or stressful environments look to DuPont Electronics & Imaging for extraordinary solutions.
Die Encapsulants
Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.
Lid Seal Adhesives
DuPont’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.
Permanent Bonding Dielectrics
Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.
Thermal Interface Materials
Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices.
Si Precursors
Silicon precursors are high-purity gas or liquid materials used in key steps during the manufacture of semiconductor devices.
Spin-on dielectrics
Spin-on dielectric materials to make multilevel metal ICs more planar, reducing process complexity and cost.
