Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition, and Metal Film Metrology semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, & LED industries. We endeavor to be a leader in our product lines. To achieve this, we have been providing unique innovative and cost-effective technical solutions, high quality equipment, and on time spare parts delivery worldwide. We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships.
We understand that a timely responsive support and service are critical elements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. We provide on-site installation, training, maintenance, system optimization, retrofits, and/or customized upgrades.KEYWORDS: Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10, System One Stripper, Model 105, System One Etcher, model 303, model 403,Matrix 1107, Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher, Plasma Asher, Plasma Descum, Dry Clean, Downstream Asher,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010 Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Plasma RIE ,Reactive Ion Etch System, Reactive Ion Etch System, Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 915,Tegal 701,Tegal 703,Tegal 801,Tegal 803,Tegal 981e,Tegal 903e , Plasma Etcher, Please Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Lam AutoEtch 490, Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790, Lam Rainbow 4400, Lam Rainbow 4420, Lam Rainbow 4428, Lam Rainbow 4500, Lam Rainbow 4520, Lam Rainbow 4528, Lam Rainbow 4600, Lam Rainbow 4620, Lam Rainbow 4628, Lam Rainbow 4700, Lam Rainbow 4720, Lam Rainbow 4728, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics AE 2001, Microwave Etcher, Microwave Plasma Etcher, Microwave Etch, Downstream Plasma Etch, Rapid Thermal Process, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG Minipulse 310, Atmospheric Rapid Thermal Process, Vacuum Rapid Thermal Process, Furnace, Oven, Thermal Furnace, Thermal Process, Thermal Processing,JIPELEC, ag2146,JetClip,JetStar, AST SHS2000, AST STEAG 2800, ssintegration, Rapid Thermal Oxide,JetFirst ,Mattson, annealsys, heatpulse ,ag 2146,Koyo Thermo Systems,AST STEAG-MATTSON 2800, heat pulse, Solaris, Eclipse ,modularpro, RLA-1000, AG Heatpulse, rapid thermal processor, Steag AST SHS2000, Solaris 75, Solaris75,STEAG Electronic Systems ,eng-sol, Annealsys, RLA-3000, Engineering Solutions ，Solaris 150, Rapid Thermal Annealer , AS-Master ,modularpro,RTO ,Modular Process Technology, Solaris150,AS-One,AS-Micro, ADDAX, JetFirst, JetLight, JetStar, Mgage 200, Mgage 300, M-gage 200, M-gage 300,Sheet Resistant measurement, Metrology, Tencor M-Gage 300,Tencor M-Gage 200, sheet resistance, sheet resistance Measurement, Semiconductor Equipment, Semiconductor metrology Equipment, KLA-Tencor, Tencor, Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,Perkin-Elmer 4480, Perkin-Elmer 2400, Perkin Elmer 4400, Perkin Elmer 4410, Perkin Elmer 4450,Perkin Elmer 4480, Perkin Elmer 2400, Sputter, Magnetron Sputter, Diode Sputter, DC Sputter, RF Sputter, DC Magnetron Sputter, RF Magnetron Sputter, Co-sputter, Reactive Sputter, MRC, MRC 603, MRC 903, MRC 602, MRC 902, MRC 604, MRC 904, MRC 924, Plasma Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition, PVD, Physical Vapor Deposition, Singulus,singular, pecvd,Plasma Enhanced Chemical Vapor Deposition, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Furnace, MRL, MRL 4 Stack,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment
AW-303R Etcher
byPlasma Etch RIE Equipment
AW-303R Plasma Etcher
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AccuThermo AW 610 RTP
byAtmospheric Rapid Thermal Process, Rapid Thermal Process Equipment
AccuThermo AW 610 RTP, 150-840 C or 400-1250 C. 1-6 gas lines with MFCs. Small samples to 6 inch Round/Square Substrate.
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AccuThermo AW 810 RTP
byAtmospheric Rapid Thermal Process, Rapid Thermal Process Equipment
AccuThermo AW 810 RTP, 150-840 C or 400-1250 C. 1-4 gas lines with MFCs. Small samples to 8 inch Round/Square Substrate.
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AccuThermo AW 820 RTP
byAtmospheric Rapid Thermal Process, Rapid Thermal Process Equipment
AccuThermo AW 820 RTP, 150-840 C or 400-1250 C. 1-6 gas lines with MFCs. Small samples to 8inch Round/Square Substrate. Stand Alone. Long time and high temperature configurations are optional.
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AccuThermo AW 820V – Vacuum RTP
byRapid Thermal Process Equipment, Vacuum Rapid Thermal Process
AccuThermo AW 820 RTP, 150-840 C or 400-1250 C. 1-6 gas lines with MFCs. Small samples to 8inch Round/Square Substrate. Stand Alone. With Vacuum function. Can be configured with Dry pump or Dry pump with turbo pump for high vacuum. Not recommended! Long time and high temperature configurations are optional.
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AccuSputter AW 4450 Sputter
bySputter Deposition Equipment
AccuSputter AW 4450 Sputter: Manual, with Load Lock,RF/DC; Diode/Magnetron, Wafer Size: Small~8 inch. New Condition. ~3xDelta Shape OR ~4xCircle Shape
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AW-105R Plasma Asher
byPlasma Asher Descum Equipment
AW-105R Plasma Stripper Asher . Wafer Size: 3-6.25 inch. 1-4 gas lines with MFCs. 60-200C Temperature with CLTC control . Anodized Chuck with Element heating and chiller cooling. Stand Alone. Integrated solid robotic wafer transfer. Single Wafer Process. Suitable for high uniformity, repeatability processes.
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AW-1008 Plasma Stripper/Asher
byPlasma Asher Descum Equipment
AW-1008 Plasma Stripper Asher . Wafer Size: 3-6 inch. 1-4 gas lines with MFCs. 100-200C Temperature without control and 200-350C with CLTC. IR Lamp Heating. Stand Alone. Integrated solid robotic wafer transfer. Single Wafer Process. Suitable for high temperature, quick stripper processes.
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AW-B3000 Plasma Asher
byPlasma Asher Descum Equipment
AW-B3000 Plasma Asher Descum Clean. Small Samples to 8 inch. 1-4 gas lines with MFCs. 100-200C Temperature without control. Desktop or Stand Alone. Manual Load, Batch Process. Low cost. Suitable for no uniformity requirement processes.
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AW-2001R Etcher
byPlasma Etch RIE Equipment
AW-2001R Plasma Etcher
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AW-901eR Plasma Etch RIE
byPlasma Etch RIE Equipment
AW-901e Plasma Etch RIE
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AW-903eR Plasma Etch RIE
byPlasma Etch RIE Equipment
AW-903e Plasma Etch RIE
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AWgage-150 Non-Contact Thickness/Resistance
byMetal Film Metrology
AWgage-150 Non-Contact Thin Film Sheet Resistance Measurement Instrument. 2 to 6 inch wafers. 1mΩ/square to 19,990 Ω/square measurement range capability. Repeatability: 1-6±%.Mapping Function. Touch Screen. PC control
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AWgage-200 Non-Contact Thickness/Resistance
byMetal Film Metrology
AWgage-200 Non-Contact Thin Film Sheet Resistance Measurement Instrument. 3 to 8 inch wafers. 1mΩ/square to 19,990 Ω/square measurement range capability. Repeatability: 1-6±%.Mapping Function. Touch Screen. PC control
