Kanematsu PWS have own technical department, and it is possible to propose various units・systems according to customers' required specifications.
We can provide solutions that design and manufacture systems that do not exist in the catalog according to customer's required specifications.
Direct metal bonding system for IGBT module
IGBTモジュール用メタルボンディング装置
＊This system can direct bonding by using ultrasonic wave method after correcting the bonding position by image processing.
＊This system is used in the assembly process of high voltage · high current electronic module such as IGBT module.
Reticle mask stocker
WS00225
This equipment is a stocker that keeps and manages the reticle mask with a case.
Storage in a clean environment and static elimination effect with an ionizer also neutralize the charge of 1.2 KV to less than 0.5 KV within 1 minute.
Non-contact method wafer thickness measuring system
非接触式ウエハー厚み測定装置
We can offer a new WF thickness measurement system by non-contact method.
This non-contact method use a pneumatic sensor and a completely different method from the conventional method.
＊measurement accuracy ±1μ
＊Cassette to Cassette, wafer auto handling
＊Capable from 4inch to 12inch wafer
Wafer transfer system
ウエハー移載機
We design and manufacture according to required wafer size, transfer specifications.
