Advanced Solutions for Semiconductor
Bruker's suite of technologies for semiconductor manufacturing address critical metrology and process needs across the broadest range of applications from R&D to process improvement. 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation products. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition.
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Automated AFM Metrology
Automated AFM metrology solutions reliably measure surface roughness, chemical mechanical planarization (CMP), and etch-depth features
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Cryo Dry Cleaning
Cryogenic CO₂ Cleaning Systems remove contaminants and residues from wafers and electronic devices
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Nanomechanical Metrology Tools
Automated metrology solutions deliver high-speed, high-resolution, highest-sensitivity mechanical property and/or interfacial adhesion measurements
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Photomask Repair
Precise, accurate photomask repair systems address the critical production issue of controlling pattern defects on high-end photomasks
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Stylus Profilometers
Stylus Metrology
Surface roughness characterization, step height measurements, and film stress analyses
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White Light Interferometry
Advanced WLI profilers provide robust metrology-based inspection for advanced packaging applications
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X-Ray Defect Inspection
Bruker defect detection systems detect crystalline defects, such as cracks, slip, dislocations, and micropipes on single-crystal substrates
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X-Ray Metrology for Compound Semi
Diverse x-ray metrology systems deliver high-quality QC monitoring and detailed R&D analysis of epi-layer films
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X-Ray Metrology for Silicon Semi
Non-destructive x-ray metrology solutions for thin-films identifying substrate defects and performing front end of line control of epi films and high-k dielectrics, as well as analyzing metal films and wafer-level packaging bumps
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